參數(shù)資料
型號(hào)： MPC8572CVTAUND
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 1333 MHz, MICROPROCESSOR, PBGA1023
封裝： 33 X 33 MM, LEAD FREE, PLASTIC, FCBGA-1023
文件頁數(shù)： 28/138頁
文件大?。?/td> 1502K
代理商： MPC8572CVTAUND
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
123
Thermal
20 Thermal
This section describes the preliminary thermal specifications of the MPC8572E. This is subject to change.
Table 81 shows the thermal characteristics for the package, 1023 33x33 FC-PBGA.
The package uses a 29.6 x 29.6 mm lid that attaches to the substrate. Recommended maximum heat sink
force is 10 pounds force (45 Newton).
20.1
Temperature Diode
The MPC8572E has a temperature diode on the microprocessor that can be used in conjunction with other
system temperature monitoring devices (such as Analog Devices, ADT7461). These devices use the
negative temperature coefficient of a diode operated at a constant current to determine the temperature of
the microprocessor and its environment. It is recommended that each MPC8572E device be calibrated.
The following are the specifications of the on-board temperature diode:
Vf > 0.40 V
Vf < 0.90 V
Operating range 2–300
μA
Diode leakage < 10 nA @ 125
°C
An approximate value of the ideality may be obtained by calibrating the device near the expected
operating temperature.
Table 81. Package Thermal Characteristics
Rating
Board
Symbol
Value
Unit
Notes
Junction to ambient, natural convection
Single-layer (1s)
RΘJA
15
°C/W
1, 2
Junction to ambient, natural convection
Four-layer (2s2p)
RΘJA
11
°C/W
1, 3
Junction to ambient (at 200 ft./min.)
Single-layer (1s)
RΘJMA
11
°C/W
1, 3
Junction to ambient (ar 200 ft./min.)
Four-layer (2s2p)
RΘJMA
8
°C/W
1, 3
Junction to board
—
RΘJB
4
°C/W
4
Junction to case
—
RΘJC
0.5
°C/W
5
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance
2. Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
5. Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method
(MIL SPEC-883, Method 1012.1).
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8572CVTAVNE 功能描述:微處理器 - MPU R211 NoE NoPb 1500 Ext RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572DS 功能描述:開發(fā)板和工具包 - 其他處理器 MICRO-ATX HIGH PERFORMAN RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC8572EAMC 功能描述:微處理器 - MPU MPC8572 AMC RAPID SYSTEM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572EAMC-SA 制造商:Freescale Semiconductor 功能描述:MPC8572 AMC RAPID SYSTEM - Bulk
MPC8572ECLPXARLE 功能描述:微處理器 - MPU R211 Enc SnPb 1067LP Ext RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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