MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specifications, Rev. 4
72
Freescale Semiconductor
Thermal
the heat sink should be slowly removed. Heating the heat sink to 40-50C with an air gun can soften the
interface material and make the removal easier. The use of an adhesive for heat sink attach is not
recommended.
Figure 45. Thermal Performance of Select Thermal Interface Materials
The system board designer can choose between several types of thermal interface. There are several
commercially-available thermal interfaces provided by the following vendors:
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dowcorning.com
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company
800-347-4572
18930 West 78th St.
0
0.5
1
1.5
2
0
1020
30
4050
6070
80
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Specific
Th
er
mal
R
e
sistance
(K-in.
2
/W
)