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    參數(shù)資料
    

    


    


    
型號(hào)：
MPC8555PXAPDX

    

    
廠商：
FREESCALE SEMICONDUCTOR INC

    

    
元件分類：
微控制器/微處理器

    

    
英文描述：
32-BIT, 833 MHz, RISC PROCESSOR, PBGA783

    

    
封裝：
29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783

    

    
文件頁(yè)數(shù)：
74/88頁(yè)

    

    
文件大?。?/td>
1244K

    

    
代理商：
MPC8555PXAPDX


    

    

    

	
    
    
    

    
    
	
    MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specifications, Rev. 4
    76
    Freescale Semiconductor
    Thermal
    Figure 48. Exploded Views (2) of a Heat Sink Attachment using a Plastic Force
    The die junction-to-ambient and the heat sink-to-ambient thermal resistances are common figure-of-merits
    used for comparing the thermal performance of various microelectronic packaging technologies, one
    should exercise caution when only using this metric in determining thermal management because no single
    parameter can adequately describe three-dimensional heat flow. The final die-junction operating
    temperature is not only a function of the component-level thermal resistance, but the system level design
    and its operating conditions. In addition to the component’s power consumption, a number of factors affect
    the final operating die-junction temperature: airflow, board population (local heat flux of adjacent
    components), system air temperature rise, altitude, etc.
    Due to the complexity and the many variations of system-level boundary conditions for today’s
    microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation convection
    and conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models
    for the boards, as well as, system-level designs.
    
    
    
    
    
    


    


    

    相關(guān)PDF資料
    		

    PDF描述
    		

    
    

    
MPC8555CPXAQFX
32-BIT, 1000 MHz, RISC PROCESSOR, PBGA783

    

    
MPC8555ECVTAKDX
32-BIT, 600 MHz, RISC PROCESSOR, PBGA783

    

    
MPC8555VTALEX
32-BIT, 667 MHz, RISC PROCESSOR, PBGA783

    

    
MPC8555CPXALFX
32-BIT, 667 MHz, RISC PROCESSOR, PBGA783

    

    
MPC8555PXAJEX
32-BIT, 533 MHz, RISC PROCESSOR, PBGA783

    

    

    

    


    


    

    相關(guān)代理商/技術(shù)參數(shù)
    		

    參數(shù)描述
    		

    
    

    
MPC8555PXAPF
功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324

    

    
MPC8555PXAQF
功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324

    

    
MPC8555VTAJD
功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324

    

    
MPC8555VTALF
功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324

    

    
MPC8555VTAPF
功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324

    

    
    
    
    
	
    	
    
    
     
     
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