參數(shù)資料
型號: MPC8555EVTALD
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
封裝: 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù): 18/88頁
文件大?。?/td> 1110K
代理商: MPC8555EVTALD
MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specification, Rev. 4.2
Freescale Semiconductor
25
Ethernet: Three-Speed, MII Management
8.2.2.1
GMII Receive AC Timing Specifications
Table 21 provides the GMII receive AC timing specifications.
Figure 8 provides the AC test load for TSEC.
Figure 8. TSEC AC Test Load
Figure 9 shows the GMII receive AC timing diagram.
Figure 9. GMII Receive AC Timing Diagram
Table 21. GMII Receive AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 5%.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
RX_CLK clock period
tGRX
—8.0
ns
RX_CLK duty cycle
tGRXH/tGRX
40
60
%
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
tGRDVKH
2.0
ns
RXD[7:0], RX_DV, RX_ER hold time to RX_CLK
tGRDXKH
0.5
ns
RX_CLK clock rise and fall time
tGRXR, tGRXF
2,3
——
1.0
ns
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGRDVKH
symbolizes GMII receive timing (GR) with respect to the time data input signals (D) reaching the valid state (V) relative to
the tRX clock reference (K) going to the high state (H) or setup time. Also, tGRDXKL symbolizes GMII receive timing (GR)
with respect to the time data input signals (D) went invalid (X) relative to the tGRX clock reference (K) going to the low (L)
state or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing
the clock of a particular functional. For example, the subscript of tGRX represents the GMII (G) receive (RX) clock. For rise
and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
2. Signal timings are measured at 0.7 V and 1.9 V voltage levels.
3. Guaranteed by design.
Output
Z0 = 50 Ω
LVDD/2
RL = 50 Ω
RX_CLK
RXD[7:0]
tGRDXKH
tGRX
tGRXH
tGRXR
tGRXF
tGRDVKH
RX_DV
RX_ER
相關(guān)PDF資料
PDF描述
MPC8555ECPXAJF RISC PROCESSOR, PBGA783
MPC8555EPXAJD 32-BIT, 533 MHz, RISC PROCESSOR, PBGA783
MPC8555EVTAJD 32-BIT, 533 MHz, RISC PROCESSOR, PBGA783
MPC8555ECPXAJE RISC PROCESSOR, PBGA783
MPC8555EPXAQF 32-BIT, 1000 MHz, RISC PROCESSOR, PBGA783
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8555EVTALF 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8555EVTAPF 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8555EVTAQF 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8555PXAJD 功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8555PXALF 功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324