參數(shù)資料
型號： MPC8555EVTAKDX
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 600 MHz, RISC PROCESSOR, PBGA783
封裝： 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù)： 83/88頁
文件大?。?/td> 1244K
代理商： MPC8555EVTAKDX
MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specifications, Rev. 4
84
Freescale Semiconductor
Document Revision History
18 Document Revision History
Table 58 provides a revision history for this hardware specification.
19 Device Nomenclature
Ordering information for the parts fully covered by this specification document is provided in
19.1
Nomenclature of Parts Fully Addressed by this Document
Table 52 provides the Freescale part numbering nomenclature for the MPC8555E. Note that the individual
part numbers correspond to a maximum processor core frequency. For available frequencies, contact your
Rev. No.
Date
Substantive Change(s)
4
12/2006
Updated back page information.
3.2
11/2006
3.1
10/2005
Table 4: Added footnote 2 about junction temperature.
Table 4: Added max. power values for 1000 MHz core frequency.
Removed Figure 3, “Maximum AC Waveforms on PCI Interface for 3.3-V Signaling.”
Table 30: Modified note to tLBKSKEW from 8 to 9
Table 30: Changed tLBKHOZ1 and tLBKHOV2 values.
Table 30: Added note 3 to tLBKHOV1.
Table 30 and Table 31: Modified note 3.
Table 31: Added note 3 to tLBKLOV1.
Table 31: Modified values for tLBKHKT, tLBKLOV1, tLBKLOV2, tLBKLOV3, tLBKLOZ1, and tLBKLOZ2.
Figure 20: Changed Input Signals: LAD[0:31]/LDP[0:3].
Table 43: Modified note for signal CLK_OUT.
Table 43: PCI1_CLK and PCI2_CLK changed from I/O to I.
Table 52: Added column for Encryption Acceleration.
3
8/29/2005
Table 4: Modified max. power values.
Table 43: Modified notes for signals TSEC1_TXD[3:0], TSEC2_TXD[3:0], TRIG_OUT/READY,
MSRCID4, CLK_OUT, and MDVAL.
2
8/2005
Previous revision’s history listed incorrect cross references. Table 2 is now correctly listed as
Table 27 and Table 38 is now listed as Table 31.
Table 7: Added note 2.
Table 14: Modified min and max values for tDDKHMP
16/2005
Table 27: Changed LVdd to OVdd for the supply voltage Ethernet management interface.
Table 4: Modified footnote 4 and changed typical power for the 1000MHz core frequency.
Table 31: Corrected symbols for body rows 9–15, effectively changing them from a high state to a
low state.
0
6/2005
Initial Release.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8555EVTAKE 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8555EVTALF 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8555EVTAPF 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8555EVTAQF 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8555PXAJD 功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
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