參數(shù)資料
型號： MPC8555ECVTALFX
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
封裝： 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù)： 68/88頁
文件大?。?/td> 1244K
代理商： MPC8555ECVTALFX
MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specifications, Rev. 4
70
Freescale Semiconductor
Thermal
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Several
heat sinks offered by Aavid Thermalloy, Alpha Novatech, IERC, Chip Coolers, Millennium Electronics,
and Wakefield Engineering offer different heat sink-to-ambient thermal resistances, that will allow the
MPC8555E to function in various environments.
16.2.1
Recommended Thermal Model
For system thermal modeling, the MPC8555E thermal model is shown in Figure 52. Five cuboids are used
to represent this device. To simplify the model, the solder balls and substrate are modeled as a single block
29x29x1.6 mm with the conductivity adjusted accordingly. The die is modeled as 8.7 x 9.3 mm at a
thickness of 0.75 mm. The bump/underfill layer is modeled as a collapsed resistance between the die and
substrate assuming a conductivity of 4.4 W/mK in the thickness dimension of 0.07 mm. The lid attach
adhesive is also modeled as a collapsed resistance with dimensions of 8.7 x 9.3 x 0.05 mm and the
conductivity of 1.07 W/mK. The nickel plated copper lid is modeled as 11 x 11 x 1 mm.
Figure 43. MPC8555E Thermal Model
Die
Lid
Substrate and solder balls
Heat Source
Substrate
Side View of Model (Not to Scale)
Top View of Model (Not to Scale)
x
y
z
Conductivity
Value
Unit
Lid
(11
× 11 × 1 mm)
kx
360
W/(m
× K)
ky
360
kz
360
Lid Adhesive—Collapsed resistance
(8.7
× 9.3 × 0.05 mm)
kz
1.07
Die
(8.7
× 9.3 × 0.75 mm)
Bump/Underfill—Collapsed resistance
(8.7
× 9.3 × 0.07 mm)
kz
4.4
Substrate and Solder Balls
(25
× 25 × 1.6 mm)
kx
14.2
ky
14.2
kz
1.2
Adhesive
Bump/underfill
相關(guān)PDF資料
PDF描述
MPC8555ECVTAQDX 32-BIT, 1000 MHz, RISC PROCESSOR, PBGA783
MPC8555CPXALDX 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
MPC8555CVTAKFX 32-BIT, 600 MHz, RISC PROCESSOR, PBGA783
MPC8555VTAQDX 32-BIT, 1000 MHz, RISC PROCESSOR, PBGA783
MPC8555EVTAKDX 32-BIT, 600 MHz, RISC PROCESSOR, PBGA783
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