參數(shù)資料
型號(hào): MPC8555CPXALF
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
封裝: 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù): 21/88頁
文件大小: 772K
代理商: MPC8555CPXALF
MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specification, Rev. 3.1
28
Freescale Semiconductor
Ethernet: Three-Speed, MII Management
8.2.4.2
TBI Receive AC Timing Specifications
Table 25 provides the TBI receive AC timing specifications.
Figure 12 shows the TBI receive AC timing diagram.
Figure 12. TBI Receive AC Timing Diagram
8.2.5
RGMII and RTBI AC Timing Specifications
Table 26 presents the RGMII and RTBI AC timing specifications.
Table 25. TBI Receive AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 5%.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
RX_CLK clock period
tTRX
16.0
ns
RX_CLK skew
tSKTRX
7.5
8.5
ns
RX_CLK duty cycle
tTRXH/tTRX
40
60
%
RCG[9:0] setup time to rising RX_CLK
tTRDVKH
2.5
ns
RCG[9:0] hold time to rising RX_CLK
tTRDXKH
1.5
ns
RX_CLK clock rise time and fall time
tTRXR, tTRXF
2,3
0.7
2.4
ns
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tTRDVKH
symbolizes TBI receive timing (TR) with respect to the time data input signals (D) reach the valid state (V) relative to the
tTRX clock reference (K) going to the high (H) state or setup time. Also, tTRDXKH symbolizes TBI receive timing (TR) with
respect to the time data input signals (D) went invalid (X) relative to the tTRX clock reference (K) going to the high (H) state.
Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a
particular functional. For example, the subscript of tTRX represents the TBI (T) receive (RX) clock. For rise and fall times,
the latter convention is used with the appropriate letter: R (rise) or F (fall). For symbols representing skews, the subscript
is skew (SK) followed by the clock that is being skewed (TRX).
2. Guaranteed by design.
RX_CLK1
RXD[9:0]
tTRX
tTRXH
tTRXR
tTRXF
tTRDVKH
RX_CLK0
tTRDXKH
tTRDVKH
tTRDXKH
tSKTRX
tTRXH
Valid Data
相關(guān)PDF資料
PDF描述
MPC8555VTALD 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
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參數(shù)描述
MPC8555CVTAJD 功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8555ECPXAJD 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8555ECPXALF 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8555ECVTAJD 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8555ECVTALF 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324