參數(shù)資料
型號: MPC8555CPXALDX
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
封裝: 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù): 73/88頁
文件大?。?/td> 1244K
代理商: MPC8555CPXALDX
MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
75
Thermal
The spring mounting should be designed to apply the force only directly above the die. By localizing the
force, rocking of the heat sink is minimized. One suggested mounting method attaches a plastic fence to
the board to provide the structure on which the heat sink spring clips. The plastic fence also provides the
opportunity to minimize the holes in the printed-circuit board and to locate them at the corners of the
package. Figure 47 and provide exploded views of the plastic fence, heat sink, and spring clip.
Figure 47. Exploded Views (1) of a Heat Sink Attachment using a Plastic Fence
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PDF描述
MPC8555CVTAKFX 32-BIT, 600 MHz, RISC PROCESSOR, PBGA783
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