
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
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Freescale Semiconductor
Package Description
18 Package Description
This section details package parameters, pin assignments, and dimensions.
18.1
Package Parameters
The package parameters for both the HiCTE FC-CBGA and FC-PBGA are as provided in
Table 66.Table 66. Package Parameters
Parameter
CBGA1
PBGA2
Package outline
29 mm
× 29 mm
29 mm
× 29 mm
Interconnects
783
Ball pitch
1 mm
Ball diameter (typical)
0.6 mm
Solder ball
62% Sn
36% Pb
2% Ag
62% Sn
36% Pb
2% Ag
Solder ball (lead-free)
95% Sn
4.5% Ag
0.5% Cu
96.5% Sn
3.5% Ag
Notes:
1. The HiCTE FC-CBGA package is available on only Version 2.0 of the device.
2. The FC-PBGA package is available on only Version 2.1.1 and 2.1.2 of the
device.