參數(shù)資料
型號： MPC8548EHXAUJ
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 1333 MHz, MICROPROCESSOR, CBGA783
封裝： 29 X 29 MM, 1 MM PITCH, CERAMIC, BGA-783
文件頁數(shù)： 32/143頁
文件大?。?/td> 1460K
代理商： MPC8548EHXAUJ
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 8
Freescale Semiconductor
127
Thermal
21 Thermal
This section describes the thermal specifications of the MPC8548.
21.1
Thermal for Version 2.0 Silicon HiCTE FC-CBGA with Full Lid
This section describes the thermal specifications for the HiCTE FC-CBGA package for revision 2.0
silicon.
Table 84 shows the package thermal characteristics.
21.2
Thermal for Version 2.1.1 and 2.1.2 Silicon FC-PBGA with Full Lid
This section describes the thermal specifications for the FC-PBGA package for revision 2.1.1 silicon.
Table 85 shows the package thermal characteristics.
Table 84. Package Thermal Characteristics for HiCTE FC-CBGA
Characteristic
JEDEC Board
Symbol
Value
Unit
Notes
Die junction-to-ambient (natural convection)
Single-layer board (1s)
RθJA
17
°C/W
1, 2
Die junction-to-ambient (natural convection)
Four-layer board (2s2p)
RθJA
12
°C/W
1, 2
Die junction-to-ambient (200 ft/min)
Single-layer board (1s)
RθJA
11
°C/W
1, 2
Die junction-to-ambient (200 ft/min)
Four-layer board (2s2p)
RθJA
8°C/W
1, 2
Die junction-to-board
N/A
RθJB
3°C/W
3
Die junction-to-case
N/A
RθJC
0.8
°C/W
4
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1). The cold plate temperature is used for the case temperature, measured value includes the thermal resistance of the
interface layer.
Table 85. Package Thermal Characteristics for FC-PBGA
Characteristic
JEDEC Board
Symbol
Value
Unit
Notes
Die junction-to-ambient (natural convection)
Single-layer board (1s)
RθJA
18
°C/W
1, 2
Die junction-to-ambient (natural convection)
Four-layer board (2s2p)
RθJA
13
°C/W
1, 2
Die junction-to-ambient (200 ft/min)
Single-layer board (1s)
RθJA
13
°C/W
1, 2
Die junction-to-ambient (200 ft/min)
Four-layer board (2s2p)
RθJA
9°C/W
1, 2
Die junction-to-board
N/A
RθJB
5°C/W
3
相關(guān)PDF資料
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8548EHXAVH 制造商:Freescale Semiconductor 功能描述:MPU RISC 32BIT CMOS 1.5GHZ 1.8V/2.5V/3.3V - Bulk
MPC8548EHXAVK 制造商:Freescale Semiconductor 功能描述:PQ38 8548E - Bulk
MPC8548EPXANJB 制造商:Freescale Semiconductor 功能描述:PQ38 8548 - Bulk
MPC8548EPXAQGA 制造商:Freescale Semiconductor 功能描述:MPC85XX RISC 32-BIT CMOS 1GHZ 1.8V/2.5V/3.3V 783-PIN BGA TRA - Bulk
MPC8548EPXAQGB 功能描述:微處理器 - MPU FG PQ38 8548 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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