參數(shù)資料
型號(hào)： MPC8541EVTAPFX
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 833 MHz, RISC PROCESSOR, PBGA783
封裝： 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
文件頁(yè)數(shù)： 69/84頁(yè)
文件大?。?/td> 1241K
代理商： MPC8541EVTAPFX
MPC8541E PowerQUICC III Integrated Communications Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
71
Thermal
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Thermagon Inc.
888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
16.2.4
Heat Sink Selection Examples
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
16.2.4.1
Case 1
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
TJ = TI + TR + (θJC + θINT + θSA) × PD
where
TJ is the die-junction temperature
TI is the inlet cabinet ambient temperature
TR is the air temperature rise within the computer cabinet
θ
JC is the junction-to-case thermal resistance
θ
INT is the adhesive or interface material thermal resistance
θ
SA is the heat sink base-to-ambient thermal resistance
PD is the power dissipated by the device. See Table 4 and Table 5.
During operation the die-junction temperatures (TJ) should be maintained within the range specified in
Table 2. The temperature of air cooling the component greatly depends on the ambient inlet air temperature
and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (TA)
may range from 30
° to 40°C. The air temperature rise within a cabinet (T
R) may be in the range of 5° to
10
°C. The thermal resistance of some thermal interface material (θ
INT) may be about 1°C/W. For the
purposes of this example, the
θ
JC value given in Table 49 that includes the thermal grease interface and is
documented in note 4 is used. If a thermal pad is used,
θ
INT must be added.
Assuming a TI of 30C, a TR of 5C, a FC-PBGA package θJC = 0.96, and a power consumption (PD) of
8.0 W, the following expression for TJ is obtained:
Die-junction temperature: TJ = 30°C + 5°C + (0.96°C/W + θSA) × 8.0 W
The heat sink-to-ambient thermal resistance (
θ
SA) versus airflow velocity for a Thermalloy heat sink
#2328B is shown in Figure 45.
Assuming an air velocity of 2 m/s, we have an effective
θ
SA+ of about 3.3C/W, thus
TJ = 30C + 5C + (0.96C/W + 3.3C/W) × 8.0 W,
resulting in a die-junction temperature of approximately 69C which is well within the maximum
operating temperature of the component.
相關(guān)PDF資料
PDF描述
MPC8541EPXAJEX 32-BIT, 1420 MHz, RISC PROCESSOR, CBGA360
MPC8541EVTAKEX 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA360
MPC8541PXALDX 32-BIT, 1700 MHz, RISC PROCESSOR, CBGA360
MPC8541ECPXAKFX 32-BIT, 600 MHz, RISC PROCESSOR, PBGA783
MPC8541EPXAJDX 32-BIT, 533 MHz, RISC PROCESSOR, PBGA783
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8541EVTAQF 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8541PXAJD 功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8541PXALF 功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8541PXAPF 功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8541PXAQF 功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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