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| 型號： | MPC8541EPXAJEX |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 1420 MHz, RISC PROCESSOR, CBGA360 |
| 封裝： | 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, BGA-360 |
| 文件頁數(shù)： | 13/84頁 |
| 文件大?。?/td> | 1241K |
| 代理商： | MPC8541EPXAJEX |
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MPC8541E PowerQUICC III Integrated Communications Processor Hardware Specifications, Rev. 4
20
Freescale Semiconductor
Ethernet: Three-Speed, MII Management
7.2
DUART AC Electrical Specifications
Table 17 provides the AC timing parameters for the DUART interface of the MPC8541E.
8
Ethernet: Three-Speed, MII Management
This section provides the AC and DC electrical characteristics forthree-speed, 10/100/1000, and MII
management.
8.1
Three-Speed Ethernet Controller (TSEC)
(10/100/1000 Mbps)—GMII/MII/TBI/RGMII/RTBI Electrical
Characteristics
The electrical characteristics specified here apply to allGMII (gigabit media independent interface), the
MII (media independent interface), TBI (ten-bit interface), RGMII (reduced gigabit media independent
interface), and RTBI (reduced ten-bit interface) signals except MDIO (management data input/output) and
MDC (management data clock). The RGMII and RTBI interfaces are defined for 2.5 V, while the GMII
and TBI interfaces can be operated at 3.3 or 2.5 V. Whether theGMII, MII, or TBI interface is operated at
3.3 or 2.5 V, the timing is compliant with the IEEE 802.3 standard. The RGMII and RTBI interfaces follow
the Hewlett-Packard reduced pin-count interface for Gigabit Ethernet Physical Layer Device Specification
Version 1.2a (9/22/2000). The electrical characteristics for MDIO and MDC are specified in Section 8.3,
8.1.1
TSEC DC Electrical Characteristics
All GMII, MII, TBI, RGMII, and RTBI drivers and receivers comply with the DC parametric attributes
specified in Table 18 and Table 19. The potential applied to the input of a GMII, MII, TBI, RGMII, or
RTBI receiver may exceed the potential of the receiver’s power supply (i.e., a GMII driver powered from
a 3.6-V supply driving VOH into a GMII receiver powered from a 2.5-V supply). Tolerance for dissimilar
GMII driver and receiver supply potentials is implicit in these specifications. The RGMII and RTBI signals
are based on a 2.5-V CMOS interface voltage as defined by JEDEC EIA/JESD8-5.
Table 17. DUART AC Timing Specifications
Parameter
Value
Unit
Notes
Minimum baud rate
fCCB_CLK / 1048576
baud
3
Maximum baud rate
fCCB_CLK / 16
baud
1, 3
Oversample rate
16
—
2, 3
Notes:
1. Actual attainable baud rate will be limited by the latency of interrupt processing.
2. The middle of a start bit is detected as the 8th sampled 0 after the 1-to-0 transition of the start bit.
Subsequent bit values are sampled each 16th sample.
3. Guaranteed by design.
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| MPC8541EPXAKE | 功能描述:微處理器 - MPU PQ 37 LITE 8541E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8541EPXALF | 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8541EPXAPF | 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8541EPXAQF | 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8541EVTAJD | 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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