參數(shù)資料
型號： MPC8541ECPXAKFX
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 600 MHz, RISC PROCESSOR, PBGA783
封裝： 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù)： 3/84頁
文件大?。?/td> 1241K
代理商： MPC8541ECPXAKFX
MPC8541E PowerQUICC III Integrated Communications Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
11
Power Characteristics
2.1.4
Output Driver Characteristics
Table 3 provides information on the characteristics of the output driver strengths. The values are
preliminary estimates.
3
Power Characteristics
The estimated typical power dissipation for this family of PowerQUICC III devices is shown in Table 4.
Table 3. Output Drive Capability
Driver Type
Programmable
Output Impedance
(
Ω)
Supply
Voltage
Notes
Local bus interface utilities signals
25
OVDD = 3.3 V
1
42 (default)
PCI signals
25
2
42 (default)
DDR signal
20
GVDD = 2.5 V
TSEC/10/100 signals
42
LVDD = 2.5/3.3 V
DUART, system control, I2C, JTAG
42
OVDD = 3.3 V
Notes:
1. The drive strength of the local bus interface is determined by the configuration of the appropriate bits in PORIMPSCR.
2. The drive strength of the PCI interface is determined by the setting of the PCI_GNT1 signal at reset.
Table 4. Power Dissipation(1) (2)
Notes:
1. The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD..
2. Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of
other components on the board, and board thermal resistance. Any customer design must take
these considerations into account to ensure the maximum 105 degrees junction temperature is not
exceeded on this device.
CCB Frequency
(MHz)
Core Frequency
(MHz)
VDD
Typical Power(3)(4)
(W)
Maximum Power(5)
(W)
200
400
1.2
4.4
6.1
500
1.2
4.7
6.5
600
1.2
5.0
6.8
267
533
1.2
4.9
6.7
667
1.2
5.4
7.2
800
1.2
5.8
8.6
333
667
1.2
5.5
7.4
833
1.2
6.0
8.8
1000(6)
1.3
9.0
12.2
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