參數資料
型號： MPC8535ECVTATH
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 1250 MHz, MICROPROCESSOR, PBGA783
封裝： 29 X 29 MM, 2.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783
文件頁數： 16/126頁
文件大小： 2861K
代理商： MPC8535ECVTATH
MPC8535E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 3
Thermal
Freescale Semiconductor
112
The recommended attachment method to the heat sink is illustrated in Figure 73. The heat sink should be attached to the
printed-circuit board with the spring force centered over the die. This spring force should not exceed 10 pounds force (45
Newton).
Figure 73. Package Exploded Cross-Sectional View with Several Heat Sink Options
The system board designer can choose between several types of heat sinks to place on the device. Ultimately, the final selection
of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass,
attachment method, assembly, and cost. Several heat sinks offered by Aavid Thermalloy, Advanced Thermal Solutions, Alpha
Novatech, IERC, Chip Coolers, Millennium Electronics, and Wakefield Engineering offer different heat sink-to-ambient
thermal resistances, that will allow the MPC8535E to function in various environments.
2.24.3.1
Internal Package Conduction Resistance
For the packaging technology, shown in Table 70, the intrinsic internal conduction thermal resistance paths are as follows:
The die junction-to-case thermal resistance
The die junction-to-board thermal resistance
Figure 74 depicts the primary heat transfer path for a package with an attached heat sink mounted to a printed-circuit board.
Figure 74. Package with Heat Sink Mounted to a Printed-Circuit Board
Thermal Interface Material
Heat Sink
FC-PBGA Package
Heat Sink
Clip
Printed-Circuit Board
Die
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Solder Spheres
Die Junction
Die/Package
(Note the internal versus external package resistance)
相關PDF資料
PDF描述
MPC8535ECVTATHA 32-BIT, 1250 MHz, MICROPROCESSOR, PBGA783
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相關代理商/技術參數
參數描述
MPC8535ECVTATHA 功能描述:微處理器 - MPU 8535 Enc Ext Temp RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8535ECVTATLA 功能描述:微處理器 - MPU 8535 ENCRYPTED RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8536-ADK 功能描述:開發(fā)板和工具包 - 其他處理器 COMEXPRESS BASED MPC8536 RoHS:否 制造商:Freescale Semiconductor 產品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC8536AVTAKG 功能描述:微處理器 - MPU 8536 COMMERCIAL 600 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8536AVTAKGA 功能描述:微處理器 - MPU 8535 Encrypted RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
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