- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄3940 > MPC8535ECVTAKG (Freescale Semiconductor)MCU PWRQUICC II 600MHZ 783-PBGA PDF資料下載
參數(shù)資料
| 型號： | MPC8535ECVTAKG |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 19/126頁 |
| 文件大?。?/td> | 0K |
| 描述： | MCU PWRQUICC II 600MHZ 783-PBGA |
| 標準包裝： | 1 |
| 系列： | MPC85xx |
| 處理器類型： | 32-位 MPC85xx PowerQUICC III |
| 速度： | 600MHz |
| 電壓： | 1V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 783-BBGA，F(xiàn)CBGA |
| 供應商設(shè)備封裝： | 783-FCPBGA（29x29） |
| 包裝： | 托盤 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁當前第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁第111頁第112頁第113頁第114頁第115頁第116頁第117頁第118頁第119頁第120頁第121頁第122頁第123頁第124頁第125頁第126頁
Hardware Design Considerations
MPC8535E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
115
These capacitors should have a value of 0.1 F. Only ceramic SMT (surface mount technology) capacitors should be used to
minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB, feeding the VDD, TVDD,
BVDD, OVDD, GVDD, and LVDD planes, to enable quick recharging of the smaller chip capacitors. These bulk capacitors should
have a low ESR (equivalent series resistance) rating to ensure the quick response time necessary. They should also be connected
to the power and ground planes through two vias to minimize inductance. Suggested bulk capacitors—100–330 F (AVX TPS
tantalum or Sanyo OSCON). However, customers should work directly with their power regulator vendor for best values types
and quantity of bulk capacitors.
3.5
SerDes Block Power Supply Decoupling Recommendations
he SerDes1 and SerDes2 blocks require a clean, tightly regulated source of power (SnVDD and XnVDD) to ensure low jitter on
transmit and reliable recovery of data in the receiver. An appropriate decoupling scheme is outlined below.
Only surface mount technology (SMT) capacitors should be used to minimize inductance. Connections from all capacitors to
power and ground should be done with multiple vias to further reduce inductance.
First, the board should have at least 10 x 10-nF SMT ceramic chip capacitors as close as possible to the supply balls
of the chip. Where the board has blind vias, these capacitors should be placed directly below the chip supply and
ground connections. Where the board does not have blind vias, these capacitors should be placed in a ring around the
chip as close to the supply and ground connections as possible.
Second, there should be a 1-F ceramic chip capacitor from each SerDes supply (SnVDD and XnVDD) to the board
ground plane on each side of the chip. This should be done for all SerDes supplies.
Third, between the chip and any SerDes voltage regulator there should be a 10-F, low equivalent series resistance
(ESR) SMT tantalum chip capacitor and a 100-F, low ESR SMT tantalum chip capacitor. This should be done for all
SerDes supplies.
3.6
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal level. All unused active
low inputs should be tied to VDD,TVDD, BVDD, OVDD, GVDD, and LVDD as required. All unused active high inputs should be
connected to GND. All NC (no-connect) signals must remain unconnected. Power and ground connections must be made to all
external VDD,TVDD, BVDD, OVDD, GVDD, and LVDD and GND pins of the chip.
3.7
Pull-Up and Pull-Down Resistor Requirements
The chip requires weak pull-up resistors (2–10 k
Ω is recommended) on open drain type pins including I2C pins and MPIC
interrupt pins.
Correct operation of the JTAG interface requires configuration of a group of system control pins as demonstrated in Figure 78.
Care must be taken to ensure that these pins are maintained at a valid deasserted state under normal operating conditions as most
have asynchronous behavior and spurious assertion will give unpredictable results.
The following pins must NOT be pulled down during power-on reset: TSEC1_TXD[3], HRESET_REQ,
TRIG_OUT/READY/QUIESCE, MSRCID[2:4], ASLEEP. The UART_SOUT[0:1] and TEST_SEL pins must be set to a
proper state during POR configuration. Please refer to the pinlist table (see Table 62) of the individual chip for more details.
See the PCI 2.2 specification for all pull-ups required for PCI.
3.8
Output Buffer DC Impedance
The chip drivers are characterized over process, voltage, and temperature. For all buses, the driver is a push-pull single-ended
driver type (open drain for I
2C).
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 395-012-527-802 | CARD EDGE 12POS DL .100X.200 BLK |
| MPC8535EBVTANG | MCU PWRQUICC II 800MHZ 783-PBGA |
| MPC8535EBVTAKG | MCU PWRQUICC II 600MHZ 783-PBGA |
| MPC8535EAVTATH | MCU PWRQUICC II 1250MHZ 783-PBGA |
| MPC8535EAVTAQG | MCU PWRQUICC II 1000MHZ 783-PBGA |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8535ECVTAKGA | 功能描述:微處理器 - MPU 8535 Enc Ext Temp RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8535ECVTANG | 功能描述:微處理器 - MPU 8535E INDUSTRIAL 800 EXT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8535ECVTANGA | 功能描述:微處理器 - MPU 8535 Enc Ext Temp RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8535ECVTAQG | 功能描述:微處理器 - MPU 8535E INDUSTRIAL 1000 EXT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8535ECVTAQGA | 功能描述:微處理器 - MPU 8535 Enc Ext Temp RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
發(fā)布緊急采購，3分鐘左右您將得到回復。