參數(shù)資料
型號: MPC8535EBVTANG
廠商: Freescale Semiconductor
文件頁數(shù): 49/126頁
文件大?。?/td> 0K
描述: MCU PWRQUICC II 800MHZ 783-PBGA
標(biāo)準(zhǔn)包裝: 1
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 800MHz
電壓: 1V
安裝類型: 表面貼裝
封裝/外殼: 783-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤
Electrical Characteristics
MPC8535E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
29
2.4.4
eTSEC Gigabit Reference Clock Timing
This table provides the eTSEC gigabit reference clocks (EC_GTX_CLK125) AC timing specifications for the chip.
2.4.5
DDR Clock Timing
This table provides the DDR clock (DDRCLK) AC timing specifications for the chip.
Table 8. EC_GTX_CLK125 AC Timing Specifications
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Notes
EC_GTX_CLK125 frequency
fG125
125
MHz
EC_GTX_CLK125 cycle time
tG125
—8
ns
EC_GTX_CLK rise and fall time
LVDD, TVDD = 2.5V
LVDD, TVDD = 3.3V
tG125R/tG125F
——
0.75
1.0
ns
1
EC_GTX_CLK125 duty cycle
GMII, TBI
1000Base-T for RGMII, RTBI
tG125H/tG125
45
47
55
53
%2
Notes:
1. Rise and fall times for EC_GTX_CLK125 are measured from 0.5V and 2.0V for L/TVDD=2.5V, and from 0.6 and 2.7V for
L/TVDD=3.3V at 0.6 V and 2.7 V.
2. EC_GTX_CLK125 is used to generate the GTX clock for the eTSEC transmitter with 2% degradation. EC_GTX_CLK125
duty cycle can be loosened from 47/53% as long as the PHY device can tolerate the duty cycle generated by the eTSEC
GTX_CLK. See Section 2.9.2.6, “RGMII and RTBI AC Timing Specifications,” for duty cycle for 10Base-T and 100Base-T
reference clock.
Table 9. DDRCLK AC Timing Specifications
At recommended operating conditions with OVDD of 3.3V ± 5%.
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Notes
DDRCLK frequency
fDDRCLK
66
166
MHz
1
DDRCLK cycle time
tDDRCLK
6.0
15.15
ns
DDRCLK rise and fall time
tKH, tKL
0.61.0
1.2ns
2
DDRCLK duty cycle
tKHK/tDDRCLK
40
60
%
DDRCLK jitter
+/– 150
ps
3, 4
Notes:
1. Caution: The DDR complex clock to DDRCLK ratio settings must be chosen such that the resulting DDR complex
clock frequency does not exceed the maximum or minimum operating frequencies. See Section 2.23.4,
“DDR/DDRCLK PLL Ratio,” for ratio settings.
2. Rise and fall times for DDRCLK are measured at 0.6 V and 2.7 V.
3. The DDRCLK driver’s closed loop jitter bandwidth should be <500 kHz at –20 dB. The bandwidth must be set low to
allow cascade-connected PLL-based devices to track DDRCLK drivers with the specified jitter.
4. For spread spectrum clocking, guidelines are +0% to –1% down spread at a modulation rate between 20 kHz and
60 kHz on DDRCLK.
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