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| 型號(hào)： | MPC8535CVTANG |
| 廠商： | Freescale Semiconductor |
| 文件頁(yè)數(shù)： | 45/126頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | MCU PWRQUICC II 800MHZ 783-PBGA |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | MPC85xx |
| 處理器類型： | 32-位 MPC85xx PowerQUICC III |
| 速度： | 800MHz |
| 電壓： | 1V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 783-BBGA，F(xiàn)CBGA |
| 供應(yīng)商設(shè)備封裝： | 783-FCPBGA（29x29） |
| 包裝： | 托盤(pán) |
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Electrical Characteristics
MPC8535E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
25
2.1.3
Output Driver Characteristics
This table provides information on the characteristics of the output driver strengths. The values are preliminary estimates.
2.2
Power Sequencing
The chip requires its power rails to be applied in a specific sequence in order to ensure proper chip operation. These
requirements are as follows for power up:
1.
VDD_PLAT, VDD_CORE (if POWER_EN is not used to control VDD_CORE), AVDD, BVDD, LVDD, OVDD,
SVDD,S2VDD, TVDD, XVDD and X2VDD
2.
[Wait for POWER_EN to assert], then VDD_CORE (if POWER_EN is used to control VDD_CORE)
3.
GVDD
All supplies must be at their stable values within 50 ms.
Items on the same line have no ordering requirement with respect to one another. Items on separate lines must be ordered
sequentially such that voltage rails on a previous step must reach 90% of their value before the voltage rails on the current step
reach 10% of theirs.
In order to guarantee MCKE low during power-up, the above sequencing for GVDD is required. If there is no concern about any
of the DDR signals being in an indeterminate state during power-up, then the sequencing for GVDD is not required.
From a system standpoint, if any of the I/O power supplies ramp prior to the VDD platform supply, the I/Os associated with
that I/O supply may drive a logic one or zero during power-up, and extra current may be drawn by the chip.
During the Deep Sleep state, the VDD core supply is removed. But all other power supplies remain applied. Therefore, there is
no requirement to apply the VDD core supply before any other power rails when the silicon waking from Deep Sleep.
Table 4. Output Drive Capability
Driver Type
Programmable
Output Impedance
(
Ω)
Supply
Voltage
Notes
Local bus interface utilities signals
25
35
BVDD = 3.3 V
BVDD = 2.5 V
1
45(default)
125
BVDD = 3.3 V
BVDD = 2.5 V
BVDD = 1.8 V
PCI signals
25
OVDD = 3.3 V
2
42 (default)
DDR2 signal
16
32 (half strength mode)
GVDD = 1.8 V
3
DDR3 signal
20
40 (half strength mode)
GVDD = 1.5 V
2
TSEC signals
42
LVDD = 2.5/3.3 V
—
DUART, system control, JTAG
42
OVDD = 3.3 V
—
I2C
150
OVDD = 3.3 V
—
Notes:
1. The drive strength of the local bus interface is determined by the configuration of the appropriate bits in PORIMPSCR.
2. The drive strength of the PCI interface is determined by the setting of the PCI1_GNT1 signal at reset.
3. The drive strength of the DDR2 or DDR3 interface in half-strength mode is at Tj = 105°C and at GVDD (min)
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