參數(shù)資料
型號(hào)： MPC8535BVTAQGA
廠商： Freescale Semiconductor
文件頁數(shù)： 51/126頁
文件大?。?/td> 0K
描述： MCU PWRQUICC II 1000MHZ 783-PBGA
標(biāo)準(zhǔn)包裝： 1
系列： MPC85xx
處理器類型： 32-位 MPC85xx PowerQUICC III
速度： 1.0GHz
電壓： 1V
安裝類型： 表面貼裝
封裝/外殼： 783-BBGA，F(xiàn)CBGA
供應(yīng)商設(shè)備封裝： 783-FCPBGA（29x29）
包裝： 托盤
其它名稱： MPC8535BVTAQG
MPC8535BVTAQG-ND
MPC8535E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Electrical Characteristics
Freescale Semiconductor
30
2.4.6
Platform to FIFO Restrictions
Please note the following FIFO maximum speed restrictions based on platform speed. The “platform clock (CCB) frequency”
in the following formula refers to the maximum platform (CCB) frequency of the speed bins the part belongs to, which is
defined in Table 73.
For FIFO GMII mode:
FIFO TX/RX clock frequency <= platform clock frequency/3.2
For example, if the platform frequency is 533 MHz, the FIFO TX/RX clock frequency should be no more than 167 MHz
For FIFO encoded mode:
FIFO TX/RX clock frequency <= platform clock frequency/3.2
For example, if the platform frequency is 533 MHz, the FIFO TX/RX clock frequency should be no more than
167 MHz
2.4.7
Other Input Clocks
For information on the input clocks of other functional blocks of the platform such as SerDes, and eTSEC, see the specific
section of this document.
2.5
RESET Initialization
This section describes the AC electrical specifications for the RESET initialization timing requirements of the chip. This table
provides the RESET initialization AC timing specifications for the DDR SDRAM component(s).
This table provides the PLL lock times.
Table 10. RESET Initialization Timing Specifications
Parameter/Condition
Min
Max
Unit
Notes
Required assertion time of HREST
100
—
μs—
Minimum assertion time for SRESET
3—
Sysclk
1
PLL input setup time with stable SYSCLK before HRESET negation
100
—
μs—
Input setup time for POR configurations (other than PLL config) with respect to negation of
HRESET
4
—
SYSCLKs
1
Input hold time for all POR configurations (including PLL config) with respect to negation of
HRESET
2
—
SYSCLKs
1
Maximum valid-to-high impedance time for actively driven POR configurations with respect to
negation of HRESET
—
5
SYSCLKs
1
HRESET rise time
—
1
SYSCLK
—
Notes:
1. SYSCLK is the primary clock input for the chip.
Table 11. PLL Lock Times
Parameter/Condition
Min
Max
Unit
Notes
PLL lock times
—
100
μs—
Local bus PLL
—
50
μs—
PCI bus lock time
—
50
μs—
相關(guān)PDF資料
PDF描述
MPC8535BVTANG MCU PWRQUICC II 800MHZ 783-PBGA
395-012-527-801 CARD EDGE 12POS DL .100X.200 BLK
395-012-527-204 CARD EDGE 12POS DL .100X.200 BLK
MPC8535BVTAKG MCU PWRQUICC II 600MHZ 783-PBGA
395-012-527-202 CARD EDGE 12POS DL .100X.200 BLK
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8535BVTATH 功能描述:微處理器 - MPU 8535 INDUSTRIAL 1250 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8535BVTATHA 功能描述:微處理器 - MPU 8535 Non E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8535BVTATLA 功能描述:微處理器 - MPU 8535 NON E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8535CVTAKG 功能描述:微處理器 - MPU 8535 INDUSTRIAL 600 EXT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8535CVTAKGA 功能描述:微處理器 - MPU 8535 Non E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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