參數(shù)資料
型號： MPC8378EVRAGD
廠商： Freescale Semiconductor
文件頁數(shù)： 23/127頁
文件大?。?/td> 0K
描述： MPU PWRQUICC II 400MHZ 689TEPBGA
標(biāo)準(zhǔn)包裝： 27
系列： MPC83xx
處理器類型： 32-位 MPC83xx PowerQUICC II Pro
速度： 400MHz
電壓： 1V
安裝類型： 表面貼裝
封裝/外殼： 689-BBGA 裸露焊盤
供應(yīng)商設(shè)備封裝： 689-TEPBGA II（31x31）
包裝： 托盤
配用： MPC8377E-RDBA-ND - BOARD REF DES MPC8377 REV 2.1
MPC8377E-MDS-PB-ND - BOARD MODULAR DEV SYSTEM
MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
Freescale Semiconductor
119
Tyco Electronics
Chip Coolers
www.chipcoolers.com
Wakefield Engineering
www.wakefield.com
Interface material vendors include the following:
Chomerics, Inc.
www.chomerics.com
Dow-Corning Corporation
Dow-Corning Electronic Materials
www.dowcorning.com
Shin-Etsu MicroSi, Inc.
www.microsi.com
The Bergquist Company
www.bergquistcompany.com
24.3
Heat Sink Attachment
The device requires the use of heat sinks. When heat sinks are attached, an interface material is required,
preferably thermal grease and a spring clip. The spring clip should connect to the printed circuit board,
either to the board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces
that can lift the edge of the package or peel the package from the board. Such peeling forces reduce the
solder joint lifetime of the package. The recommended maximum compressive force on the top of the
package is 10 lb force (4.5 kg force). Any adhesive attachment should attach to painted or plastic surfaces,
and its performance should be verified under the application requirements.
24.3.1
Experimental Determination of the Junction Temperature with a
Heat Sink
When a heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimize the size of the clearance to minimize the change in thermal
performance caused by removing part of the thermal interface to the heat sink. Because of the experimental
difficulties with this technique, many engineers measure the heat sink temperature and then back calculate
the case temperature using a separate measurement of the thermal resistance of the interface. From this
case temperature, the junction temperature is determined from the junction to case thermal resistance.
TJ = TC + (RθJC × PD)
where:
TJ = junction temperature (°C)
TC = case temperature of the package (°C)
相關(guān)PDF資料
PDF描述
2-84534-4 CONN FFC 24POS 1.25MM VERT PCB
MPC8379EVRANG MPU PWRQUICC II 800MHZ 689TEPBGA
2-84533-7 CONN FFC 27POS 1.25MM RT ANG
355-012-520-201 CARDEDGE 12POS DL .156 LOPRO BLK
MPC8379EVRAJF MPU PWRQUICC II 533MHZ 689TEPBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8378EVRAGDA 功能描述:微處理器 - MPU 8378 PBGA ST PbFr W/ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8378EVRAGFA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8378EVRAGGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8378EVRAJDA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8378EVRAJF 功能描述:微處理器 - MPU PBGA W/ ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*