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參數(shù)資料
| 型號(hào)： | MPC8378ECVRAGGA |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 400 MHz, MICROPROCESSOR, PBGA689 |
| 封裝： | 31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-689 |
| 文件頁(yè)數(shù)： | 19/125頁(yè) |
| 文件大?。?/td> | 894K |
| 代理商： | MPC8378ECVRAGGA |
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MPC8378E PowerQUICC II Pro Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
115
23.2.4
Heat Sinks and Junction-to-Case Thermal Resistance
For the power values the device is expected to operate at, it is anticipated that a heat sink will be required. A preliminary estimate
of heat sink performance can be obtained from the following first-cut approach. The thermal resistance is expressed as the sum
of a junction to case thermal resistance and a case-to-ambient thermal resistance:
RJA = RJC + RCA
where:
RJA = junction to ambient thermal resistance (C/W)
RJC = junction to case thermal resistance (C/W)
RCA = case to ambient thermal resistance (C/W)
RJC is device-related and cannot be influenced by the user. The user controls the thermal environment to change the case to
ambient thermal resistance, RCA. For instance, the user can change the size of the heat sink, the air flow around the device, the
interface material, the mounting arrangement on printed circuit board, or change the thermal dissipation on the printed circuit
board surrounding the device.
This first-cut approach overestimates the heat sink size required, since heat flow through the board is not accounted for, which
can be as much as one-third to one-half of the power generated in the package.
Accurate thermal design requires thermal modeling of the application environment using computational fluid dynamics
software which can model both the conduction cooling through the package and board and the convection cooling due to the
air moving through the application. Simplified thermal models of the packages can be assembled using the junction-to-case and
junction-to-board thermal resistances listed in the thermal resistance table. More detailed thermal models can be made available
on request.
The thermal performance of devices with heat sinks has been simulated with a few commercially available heat sinks. The heat
sink choice is determined by the application environment (temperature, air flow, adjacent component power dissipation) and
the physical space available. Because of the wide variety of application environments, a single standard heat sink applicable to
all cannot be specified.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8378ECVRAJDA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8378ECVRAJF | 功能描述:微處理器 - MPU PBGA W/ ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8378ECVRAJFA | 功能描述:微處理器 - MPU 8378 PBGA XT PbFr W/ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8378ECVRAJGA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8378ECVRALDA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
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