參數(shù)資料
型號： MPC8360ECVVAJFGA
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 533 MHz, RISC PROCESSOR, PBGA740
封裝： 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-740
文件頁數(shù)： 8/102頁
文件大?。?/td> 606K
代理商： MPC8360ECVVAJFGA
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
13
Power Sequencing
667
333
500
6.1
6.8
W
Notes:
1. The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD. For I/O power values, see Table 6.
2. Typical power is based on a voltage of VDD = 1.2 V or 1.3 V, a junction temperature of TJ = 105° C, and a Dhrystone
benchmark application.
3. Thermal solutions need to design to a value higher than typical power on the end application, TA target, and I/O power.
4. Maximum power is based on a voltage of VDD = 1.2 V, WC process, a junction TJ = 105° C, and an artificial smoke test.
5. Maximum power is based on a voltage of VDD = 1.3 V for applications that use 667 MHz (CPU)/500 (QE) with WC process,
a junction TJ = 105° C, and an artificial smoke test.
6. Typical power is based on a voltage of VDD = 1.3 V, a junction temperature of TJ = 70° C, and a Dhrystone benchmark
application.
7. Maximum power is based on a voltage of VDD = 1.3 V for applications that use 667 MHz (CPU) or 500 (QE) with WC
process, a junction TJ = 70° C, and an artificial smoke test.
8. This frequency combination is only available for rev. 2.0 silicon.
9. This frequency combination is not available for rev. 2.0 silicon.
Table 5. MPC8358E TBGA Core Power Dissipation1
Core
Frequency (MHz)
CSB
Frequency (MHz)
QUICC Engine
Frequency (MHz)
Typical
Maximum
Unit
Notes
266
300
4.1
4.5
W
2, 3, 4
400
266
400
4.5
5.0
W
2, 3, 4
Notes:
1. The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD. For I/O power values, see Table 6.
2. Typical power is based on a voltage of VDD = 1.2 V, a junction temperature of TJ = 105° C, and a Dhrystone benchmark
application.
3. Thermal solutions need to design to a value higher than typical power on the end application, TA target, and I/O power.
4. Maximum power is based on a voltage of VDD = 1.2 V, WC process, a junction TJ = 105° C, and an artificial smoke test.
Table 4. MPC8360E TBGA Core Power Dissipation1 (continued)
Core
Frequency (MHz)
CSB
Frequency (MHz)
QUICC Engine
Frequency (MHz)
Typical
Maximum
Unit
Notes
相關(guān)PDF資料
PDF描述
MPC8358EVVAGDEA 32-BIT, 400 MHz, RISC PROCESSOR, PBGA740
MPC8360EZUALDGA 32-BIT, 667 MHz, RISC PROCESSOR, PBGA740
MPC8360VVAJDHA 32-BIT, 533 MHz, RISC PROCESSOR, PBGA740
MPC8358CZUADDEA 32-BIT, 266 MHz, RISC PROCESSOR, PBGA740
MPC8360ECVVAJDGA 32-BIT, 533 MHz, RISC PROCESSOR, PBGA740
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8360ECVVAJFHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECVVALDGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECVVALDHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECVVALFGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECVVALFHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
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