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參數資料
| 型號： | MPC8349VVALFB |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 667 MHz, MICROPROCESSOR, PBGA672 |
| 封裝： | 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-672 |
| 文件頁數： | 74/87頁 |
| 文件大?。?/td> | 1037K |
| 代理商： | MPC8349VVALFB |
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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
76
Freescale Semiconductor
Thermal
(edge) of the package is approximately the same as the local air temperature near the device. Specifying
the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
TJ = TA + (RθJA × PD)
where:
TJ = junction temperature (°C)
TA = ambient temperature for the package (°C)
RθJA = junction-to-ambient thermal resistance (°C/W)
PD = power dissipation in the package (W)
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction
temperature can be made. The application board should be similar to the thermal test condition: the
component is soldered to a board with internal planes.
20.2.3
Experimental Determination of Junction Temperature
To determine the junction temperature of the device in the application after prototypes are available, use
the thermal characterization parameter (
Ψ
JT) to determine the junction temperature and a measure of the
temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT × PD)
where:
TJ = junction temperature (°C)
TT = thermocouple temperature on top of package (°C)
Ψ
JT = junction-to-ambient thermal resistance (°C/W)
PD = power dissipation in the package (W)
The thermal characterization parameter is measured per the JESD51-2 specification using a 40 gauge type
T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
20.2.4
Heat Sinks and Junction-to-Case Thermal Resistance
Some application environments require a heat sink to provide the necessary thermal management of the
device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case
thermal resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
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相關代理商/技術參數 |
參數描述 |
|---|---|
| MPC8349ZUAGD | 功能描述:IC MPU PWRQUICC II PRO 672-TBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標準包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，FCBGA 供應商設備封裝:783-FCPBGA（29x29） 包裝:托盤 |
| MPC8349ZUAGDB | 功能描述:微處理器 - MPU 8349 TBGA W/O ENCRYP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8349ZUAGFB | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MPC8349ZUAJD | 功能描述:IC MPU PWRQUICC II PRO 672-TBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標準包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，FCBGA 供應商設備封裝:783-FCPBGA（29x29） 包裝:托盤 |
| MPC8349ZUAJDB | 功能描述:微處理器 - MPU 8349 TBGA W/O ENCRYP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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