參數(shù)資料
型號： MPC8349EZUAGFB
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 400 MHz, MICROPROCESSOR, PBGA672
封裝： 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672
文件頁數(shù)： 80/87頁
文件大?。?/td> 1037K
代理商： MPC8349EZUAGFB
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
81
System Design Information
have a low ESR (equivalent series resistance) rating to ensure the quick response time. They should also
be connected to the power and ground planes through two vias to minimize inductance. Suggested bulk
capacitors are 100–330 F (AVX TPS tantalum or Sanyo OSCON).
21.4
Connection Recommendations
To ensure reliable operation, connect unused inputs to an appropriate signal level. Unused active low
inputs should be tied to OVDD, GVDD, or LVDD as required. Unused active high inputs should be
connected to GND. All NC (no-connect) signals must remain unconnected.
Power and ground connections must be made to all external VDD, GVDD, LVDD, OVDD, and GND pins of
the MPC8349EA.
21.5
Output Buffer DC Impedance
The MPC8349EA drivers are characterized over process, voltage, and temperature. For all buses, the
driver is a push-pull single-ended driver type (open drain for I2C).
To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD
or GND. Then the value of each resistor is varied until the pad voltage is OVDD/2 (see Figure 42). The
output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
When data is held high, SW1 is closed (SW2 is open) and RP is trimmed until the voltage at the pad equals
OVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each
other in value. Then, Z0 = (RP + RN) ÷ 2.
Figure 42. Driver Impedance Measurement
Two measurements give the value of this resistance and the strength of the driver current source. First, the
output voltage is measured while driving logic 1 without an external differential termination resistor. The
measured voltage is V1 = Rsource × Isource. Second, the output voltage is measured while driving logic 1
with an external precision differential termination resistor of value Rterm. The measured voltage is
OVDD
OGND
RP
RN
Pad
Data
SW1
SW2
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8349EZUAJD 功能描述:IC MPU PWRQUICC II PRO 672-TBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標準包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA（29x29） 包裝:托盤
MPC8349EZUAJDB 功能描述:微處理器 - MPU 8349 TBGA PB W/ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8349EZUAJF 功能描述:IC MPU PWRQUICC II PRO 672-TBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標準包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA（29x29） 包裝:托盤
MPC8349EZUAJFB 功能描述:微處理器 - MPU 8349 TBGA PB W/ ENCRYP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8349EZUALDB 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications
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