參數(shù)資料
型號(hào): MPC8347ZQAGFA
廠商: FREESCALE SEMICONDUCTOR INC
元件分類(lèi): 微控制器/微處理器
英文描述: 32-BIT, 400 MHz, MICROPROCESSOR, PBGA620
封裝: 29 X 29 MM, 2.46 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-620
文件頁(yè)數(shù): 29/108頁(yè)
文件大小: 1172K
代理商: MPC8347ZQAGFA
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
27
Ethernet: Three-Speed Ethernet, MII Management
8.2.1.2
GMII Receive AC Timing Specifications
Table 25 provides the GMII receive AC timing specifications.
Figure 8 shows the GMII receive AC timing diagram.
G
Figure 8. GMII Receive AC Timing Diagram
Table 25. GMII Receive AC Timing Specifications
At recommended operating conditions with LVDD / OVDD of 3.3 V ± 10%.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
RX_CLK clock period
tGRX
—8.0
ns
RX_CLK duty cycle
tGRXH/tGRX
40
60
%
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
tGRDVKH
2.0
ns
RXD[7:0], RX_DV, RX_ER hold time to RX_CLK
tGRDXKH
0.5
ns
RX_CLK clock rise, VIL(min) to VIH(max)
tGRXR
——
1.0
ns
RX_CLK clock fall time, VIH(max) to VIL(min)
tGRXF
——
1.0
ns
Note:
1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGRDVKH symbolizes GMII receive timing
(GR) with respect to the time data input signals (D) reaching the valid state (V) relative to the tRX clock reference (K) going
to the high state (H) or setup time. Also, tGRDXKL symbolizes GMII receive timing (GR) with respect to the time data input
signals (D) went invalid (X) relative to the tGRX clock reference (K) going to the low (L) state or hold time. In general, the clock
reference symbol is based on three letters representing the clock of a particular function. For example, the subscript of tGRX
represents the GMII (G) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter:
R (rise) or F (fall).
RX_CLK
RXD[7:0]
tGRDXKH
tGRX
tGRXH
tGRXR
tGRXF
tGRDVKH
RX_DV
RX_ER
相關(guān)PDF資料
PDF描述
MPC8347VVAGFA 32-BIT, 400 MHz, MICROPROCESSOR, PBGA672
MPC8347EVVAGFA 32-BIT, 400 MHz, MICROPROCESSOR, PBGA672
MPC8347EVRADFA 32-BIT, 266 MHz, MICROPROCESSOR, PBGA620
MPC8349CZUALFB 32-BIT, 667 MHz, MICROPROCESSOR, PBGA672
MPC8349EZUAGFB 32-BIT, 400 MHz, MICROPROCESSOR, PBGA672
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8347ZUAGD 功能描述:IC MPU PWRQUICC II PRO 672-TBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類(lèi)型:32-位 MPC85xx PowerQUICC III 特點(diǎn):- 速度:1.2GHz 電壓:1.1V 安裝類(lèi)型:表面貼裝 封裝/外殼:783-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA(29x29) 包裝:托盤(pán)
MPC8347ZUAGDB 功能描述:微處理器 - MPU 8349 TBGA W/O ENCRYP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8347ZUAJD 功能描述:IC MPU PWRQUICC II PRO 672-TBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類(lèi)型:32-位 MPC85xx PowerQUICC III 特點(diǎn):- 速度:1.2GHz 電壓:1.1V 安裝類(lèi)型:表面貼裝 封裝/外殼:783-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA(29x29) 包裝:托盤(pán)
MPC8347ZUAJDB 功能描述:微處理器 - MPU 8349 TBGA W/O ENCRYP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8347ZUAJF 功能描述:IC MPU PWRQUICC II PRO 672-TBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類(lèi)型:32-位 MPC85xx PowerQUICC III 特點(diǎn):- 速度:1.2GHz 電壓:1.1V 安裝類(lèi)型:表面貼裝 封裝/外殼:783-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA(29x29) 包裝:托盤(pán)