參數(shù)資料
型號(hào)： MPC8347VVALF
廠商： FREESCALE SEMICONDUCTOR INC
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, 667 MHz, RISC PROCESSOR, PBGA672
封裝： 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-672
文件頁(yè)數(shù)： 86/102頁(yè)
文件大?。?/td> 1094K
代理商： MPC8347VVALF
MPC8347E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11
84
Freescale Semiconductor
Thermal
20 Thermal
This section describes the thermal specifications of the MPC8347E.
20.1
Thermal Characteristics
Table 61 provides the package thermal characteristics for the 672 35
× 35 mm TBGA of the MPC8347E.
Table 62 provides the package thermal characteristics for the 620 29
× 29 mm PBGA of the MPC8347E.
Table 61. Package Thermal Characteristics for TBGA
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection on single-layer board (1s)
RθJA
14
°C/W
1, 2
Junction-to-ambient natural convection on four-layer board (2s2p)
RθJMA
11
°C/W
1, 3
Junction-to-ambient (@ 200 ft/min) on single-layer board (1s)
RθJMA
11
°C/W
1, 3
Junction-to-ambient (@ 200 ft/min) on four-layer board (2s2p)
RθJMA
8
°C/W
1, 3
Junction-to-ambient (@ 2 m/s) on single-layer board (1s)
RθJMA
9
°C/W
1, 3
Junction-to-ambient (@ 2 m/s) on four-layer board (2s2p)
RθJMA
7
°C/W
1, 3
Junction-to-board thermal
RθJB
3.8
°C/W
4
Junction-to-case thermal
RθJC
1.7
°C/W
5
Junction-to-package natural convection on top
ψJT
1
°C/W
6
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal, 1 m/s is approximately equal to 200 linear feet per minute (LFM).
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
Table 62. Package Thermal Characteristics for PBGA
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection on single-layer board (1s)
RθJA
21
°C/W
1, 2
Junction-to-ambient natural convection on four-layer board (2s2p)
RθJMA
15
°C/W
1, 3
Junction-to-ambient (@ 200 ft/min) on single-layer board (1s)
RθJMA
17
°C/W
1, 3
Junction-to-ambient (@ 200 ft/min) on four-layer board (2s2p)
RθJMA
12
°C/W
1, 3
Junction-to-board thermal
RθJB
6
°C/W
4
相關(guān)PDF資料
PDF描述
MPC8347ECZQALF 32-BIT, 667 MHz, RISC PROCESSOR, PBGA620
MPC8347EVVAJF 32-BIT, 533 MHz, RISC PROCESSOR, PBGA672
MPC8347ECZUADD 32-BIT, 266 MHz, RISC PROCESSOR, PBGA672
MPC8347ECZUALD 32-BIT, 667 MHz, RISC PROCESSOR, PBGA672
MPC8347ZUAJF 32-BIT, 533 MHz, RISC PROCESSOR, PBGA672
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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MPC8347ZQAGD 功能描述:微處理器 - MPU 266 MHz w/o Encrypt RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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