參數(shù)資料
型號(hào)： MPC8347VRAJD
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 533 MHz, RISC PROCESSOR, PBGA620
封裝： 29 X 29 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-620
文件頁數(shù)： 89/102頁
文件大?。?/td> 1094K
代理商： MPC8347VRAJD
MPC8347E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11
Freescale Semiconductor
87
Thermal
where:
RθJA = junction-to-ambient thermal resistance (°C/W)
RθJC = junction-to-case thermal resistance (°C/W)
RθCA = case-to-ambient thermal resistance (°C/W)
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit
board, or change the thermal dissipation on the printed-circuit board surrounding the device.
The thermal performance of devices with heat sinks has been simulated with a few commercially available
heat sinks. The heat sink choice is determined by the application environment (temperature, air flow,
adjacent component power dissipation) and the physical space available. Because there is not a standard
application environment, a standard heat sink is not required.
Table 63 and Table 64 show heat sink thermal resistance for TBGA and PBGA of the MPC8347E.
f
Table 63. Heat Sink and Thermal Resistance of MPC8347E (TBGA)
Heat Sink Assuming Thermal Grease
Air Flow
35
× 35 mm TBGA
Thermal Resistance
AAVID 30
× 30 × 9.4 mm pin fin
Natural convection
10
AAVID 30
× 30 × 9.4 mm pin fin
1 m/s
6.5
AAVID 30
× 30 × 9.4 mm pin fin
2 m/s
5.6
AAVID 31
× 35 × 23 mm pin fin
Natural convection
8.4
AAVID 31
× 35 × 23 mm pin fin
1 m/s
4.7
AAVID 31
× 35 × 23 mm pin fin
2 m/s
4
Wakefield, 53
× 53 × 25 mm pin fin
Natural convection
5.7
Wakefield, 53
× 53 × 25 mm pin fin
1 m/s
3.5
Wakefield, 53
× 53 × 25 mm pin fin
2 m/s
2.7
MEI, 75
× 85 × 12 no adjacent board, extrusion
Natural convection
6.7
MEI, 75
× 85 × 12 no adjacent board, extrusion
1 m/s
4.1
MEI, 75
× 85 × 12 no adjacent board, extrusion
2 m/s
2.8
MEI, 75
× 85 × 12 mm, adjacent board, 40 mm side bypass
1 m/s
3.1
Table 64. Heat Sink and Thermal Resistance of MPC8347E (PBGA)
Heat Sink Assuming Thermal Grease
Air Flow
29
× 29 mm PBGA
Thermal Resistance
AAVID 30
× 30 × 9.4 mm pin fin
Natural convection
13.5
AAVID 30
× 30 × 9.4 mm pin fin
1 m/s
9.6
相關(guān)PDF資料
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