參數(shù)資料
型號： MPC8347ECZUADD
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 266 MHz, RISC PROCESSOR, PBGA672
封裝： 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672
文件頁數(shù)： 89/102頁
文件大?。?/td> 1094K
代理商： MPC8347ECZUADD
MPC8347E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11
Freescale Semiconductor
87
Thermal
where:
RθJA = junction-to-ambient thermal resistance (°C/W)
RθJC = junction-to-case thermal resistance (°C/W)
RθCA = case-to-ambient thermal resistance (°C/W)
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit
board, or change the thermal dissipation on the printed-circuit board surrounding the device.
The thermal performance of devices with heat sinks has been simulated with a few commercially available
heat sinks. The heat sink choice is determined by the application environment (temperature, air flow,
adjacent component power dissipation) and the physical space available. Because there is not a standard
application environment, a standard heat sink is not required.
Table 63 and Table 64 show heat sink thermal resistance for TBGA and PBGA of the MPC8347E.
f
Table 63. Heat Sink and Thermal Resistance of MPC8347E (TBGA)
Heat Sink Assuming Thermal Grease
Air Flow
35
× 35 mm TBGA
Thermal Resistance
AAVID 30
× 30 × 9.4 mm pin fin
Natural convection
10
AAVID 30
× 30 × 9.4 mm pin fin
1 m/s
6.5
AAVID 30
× 30 × 9.4 mm pin fin
2 m/s
5.6
AAVID 31
× 35 × 23 mm pin fin
Natural convection
8.4
AAVID 31
× 35 × 23 mm pin fin
1 m/s
4.7
AAVID 31
× 35 × 23 mm pin fin
2 m/s
4
Wakefield, 53
× 53 × 25 mm pin fin
Natural convection
5.7
Wakefield, 53
× 53 × 25 mm pin fin
1 m/s
3.5
Wakefield, 53
× 53 × 25 mm pin fin
2 m/s
2.7
MEI, 75
× 85 × 12 no adjacent board, extrusion
Natural convection
6.7
MEI, 75
× 85 × 12 no adjacent board, extrusion
1 m/s
4.1
MEI, 75
× 85 × 12 no adjacent board, extrusion
2 m/s
2.8
MEI, 75
× 85 × 12 mm, adjacent board, 40 mm side bypass
1 m/s
3.1
Table 64. Heat Sink and Thermal Resistance of MPC8347E (PBGA)
Heat Sink Assuming Thermal Grease
Air Flow
29
× 29 mm PBGA
Thermal Resistance
AAVID 30
× 30 × 9.4 mm pin fin
Natural convection
13.5
AAVID 30
× 30 × 9.4 mm pin fin
1 m/s
9.6
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8347ECZUADDB 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications
MPC8347ECZUADFB 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications
MPC8347ECZUAGDB 功能描述:微處理器 - MPU 8349 TBGA W/ ENCRYP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8347ECZUAGFB 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications
MPC8347ECZUAJDB 功能描述:微處理器 - MPU 8349 TBGA W/ ENCRYP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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