參數(shù)資料
型號(hào): MPC8347ECVVADD
廠商: FREESCALE SEMICONDUCTOR INC
元件分類(lèi): 微控制器/微處理器
英文描述: 32-BIT, 266 MHz, RISC PROCESSOR, PBGA672
封裝: 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-672
文件頁(yè)數(shù): 55/102頁(yè)
文件大小: 1094K
代理商: MPC8347ECVVADD
MPC8347E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11
56
Freescale Semiconductor
Package and Pin Listings
18.2
Mechanical Dimensions for the MPC8347E TBGA
Figure 39 shows the mechanical dimensions and bottom surface nomenclature for the MPC8347E,
672-TBGA package.
Notes:
1.All dimensions are in millimeters.
2.Dimensions and tolerances per ASME Y14.5M-1994.
3.Maximum solder ball diameter measured parallel to datum A.
4.Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5.Parallelism measurement must exclude any effect of mark on top surface of package.
Figure 39. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC8347E TBGA
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8347ECVVADDB 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications
MPC8347ECVVADFB 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications
MPC8347ECVVAGDB 功能描述:微處理器 - MPU 8349 TBGA NO PB W/ ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8347ECVVAGFB 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications
MPC8347ECVVAJDB 功能描述:微處理器 - MPU 8349 TBGA NO PB W/ ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324