參數(shù)資料
型號: MPC8323VRAFDCA
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 333 MHz, RISC PROCESSOR, PBGA516
封裝: 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, PBGA-516
文件頁數(shù): 44/82頁
文件大?。?/td> 1134K
代理商: MPC8323VRAFDCA
MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
Freescale Semiconductor
49
Package and Pin Listings
21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8323E is available in
a thermally enhanced Plastic Ball Grid Array (PBGA); see Section 21.1, “Package Parameters for the
information on the PBGA.
21.1
Package Parameters for the MPC8323E PBGA
The package parameters are as provided in the following list. The package type is 27 mm
× 27 mm, 516
PBGA.
Package outline
27 mm
× 27 mm
Interconnects
516
Pitch
1.00 mm
Module height (typical)
2.25 mm
Solder Balls
62 Sn/36 Pb/2 Ag (ZQ package)
95.5 Sn/0.5 Cu/4Ag (VR package)
Ball diameter (typical)
0.6 mm
21.2
Mechanical Dimensions of the MPC8323E PBGA
Figure 42 shows the mechanical dimensions and bottom surface nomenclature of the MPC8323E,
516-PBGA package.
相關(guān)PDF資料
PDF描述
MPC8323ZQADDCA 32-BIT, 266 MHz, RISC PROCESSOR, PBGA516
MPC8323ECZQADDCA 32-BIT, 266 MHz, RISC PROCESSOR, PBGA516
MPC8323CZQADDCA 32-BIT, 266 MHz, RISC PROCESSOR, PBGA516
MPC8323CZQAFDCA 32-BIT, 333 MHz, RISC PROCESSOR, PBGA516
MPC8323ECVRAFDCA 32-BIT, 333 MHz, RISC PROCESSOR, PBGA516
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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