- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄4078 > MPC8321EVRADDC (Freescale Semiconductor)IC MPU PWRQUICC II 516-PBGA PDF資料下載
參數(shù)資料
| 型號(hào)： | MPC8321EVRADDC |
| 廠商： | Freescale Semiconductor |
| 文件頁(yè)數(shù)： | 72/82頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU PWRQUICC II 516-PBGA |
| 標(biāo)準(zhǔn)包裝： | 40 |
| 系列： | MPC83xx |
| 處理器類(lèi)型： | 32-位 MPC83xx PowerQUICC II Pro |
| 速度： | 266MHz |
| 電壓： | 1V |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 516-BBGA |
| 供應(yīng)商設(shè)備封裝： | 516-FPBGA（27x27） |
| 包裝： | 托盤(pán) |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)當(dāng)前第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)
MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
74
Freescale Semiconductor
Thermal
where:
RθJA = junction-to-ambient thermal resistance (°C/W)
RθJC = junction-to-case thermal resistance (°C/W)
RθCA = case-to-ambient thermal resistance (°C/W)
RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit
board, or change the thermal dissipation on the printed-circuit board surrounding the device.
To illustrate the thermal performance of the devices with heat sinks, the thermal performance has been
simulated with a few commercially available heat sinks. The heat sink choice is determined by the
application environment (temperature, air flow, adjacent component power dissipation) and the physical
space available. Because there is not a standard application environment, a standard heat sink is not
required.
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
Heat sink vendors include the following list:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-567-8082
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC) 818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Millennium Electronics (MEI)
408-436-8770
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-thermal.com
Tyco Electronics
800-522-2800
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HMC20DTEF | CONN EDGECARD 40POS .100 EYELET |
| FMC36DRYN | CONN EDGECARD 72POS DIP .100 SLD |
| FMC36DRYH | CONN EDGECARD 72POS DIP .100 SLD |
| MPC850DSLZQ50BU | IC MPU PWRQUICC 50MHZ 256-PBGA |
| AMM40DTMI | CONN EDGECARD 80POS R/A .156 SLD |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8321EVRAFDC | 功能描述:微處理器 - MPU 8321 NOPB PBGA W/ ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8321EVRAFDC | 制造商:Freescale Semiconductor 功能描述:Embedded Networking Processor |
| MPC8321EVRAFDCA | 制造商:Freescale Semiconductor 功能描述:POWERQUICC, 32 BIT POWER ARCHITECTURE SOC, 333MHZ E300, QE, - Trays 制造商:Freescale Semiconductor 功能描述:IC MPU PWRQUICC 333MHZ 516BGA 制造商:Freescale Semiconductor 功能描述:MPC8321 Series 32 Bit 333 MHz PowerQUICC II Integrated Communication Processor 制造商:Freescale Semiconductor 功能描述:PowerQUICC, 32 Bit Power Architecture SoC, 333MHz e300, QE, PCI, USB2.0, DDR1/2, |
| MPC8321EZQADDC | 功能描述:微處理器 - MPU 8321 PBGA W/ ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8321EZQAFDC | 功能描述:微處理器 - MPU 8321 PBGA W/ ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。