This table provides the DDR capacitan" />
參數(shù)資料
型號(hào)： MPC8313ZQAFFB
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 8/99頁(yè)
文件大?。?/td> 0K
描述： MPU POWERQUICC II PRO 516-PBGA
標(biāo)準(zhǔn)包裝： 40
系列： MPC83xx
處理器類型： 32-位 MPC83xx PowerQUICC II Pro
速度： 333MHz
電壓： 0.95 V ~ 1.05 V
安裝類型： 表面貼裝
封裝/外殼： 516-BBGA 裸露焊盤
供應(yīng)商設(shè)備封裝： 516-PBGAPGE（27x27）
包裝： 托盤
MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
16
Freescale Semiconductor
This table provides the DDR capacitance when GVDD(typ) = 2.5 V.
This table provides the current draw characteristics for MVREF.
6.2
DDR and DDR2 SDRAM AC Electrical Characteristics
This section provides the AC electrical characteristics for the DDR SDRAM interface.
6.2.1
DDR and DDR2 SDRAM Input AC Timing Specifications
This table provides the input AC timing specifications for the DDR2 SDRAM when GVDD(typ) = 1.8 V.
Output leakage current
IOZ
–9.9
A4
Output high current (VOUT = 1.95 V)
IOH
–16.2
—
mA
—
Output low current (VOUT = 0.35 V)
IOL
16.2
—
mA
—
Note:
1. GVDD is expected to be within 50 mV of the DRAM GVDD at all times.
2. MVREF is expected to be equal to 0.5 GVDD, and to track GVDD DC variations as measured at the receiver. Peak-to-peak
noise on MVREF may not exceed ±2% of the DC value.
3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be
equal to MVREF. This rail should track variations in the DC level of MVREF.
4. Output leakage is measured with all outputs disabled, 0 V
V
OUT GVDD.
Table 15. DDR SDRAM Capacitance for GVDD(typ) = 2.5 V
Parameter/Condition
Symbol
Min
Max
Unit
Note
Input/output capacitance: DQ, DQS
CIO
68
pF
1
Delta input/output capacitance: DQ, DQS
CDIO
—0.5
pF
1
Note:
1. This parameter is sampled. GVDD = 2.5 V ± 0.125 V, f = 1 MHz, TA =25°C, VOUT = GVDD/2, VOUT (peak-to-peak) = 0.2 V.
Table 16. Current Draw Characteristics for MVREF
Parameter/Condition
Symbol
Min
Max
Unit
Note
Current draw for MVREF
IMVREF
—500
A1
Note:
1. The voltage regulator for MVREF must be able to supply up to 500 A current.
Table 17. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface
At recommended operating conditions with GVDD of 1.8 ± 5%.
Parameter
Symbol
Min
Max
Unit
Note
AC input low voltage
VIL
—MVREF – 0.25
V
—
AC input high voltage
VIH
MVREF + 0.25
—
V
—
Table 14. DDR SDRAM DC Electrical Characteristics for GVDD(typ) = 2.5 V (continued)
Parameter/Condition
Symbol
Min
Max
Unit
Note
相關(guān)PDF資料
PDF描述
MPC8313CZQADDB MPU POWERQUICC II PRO 516-PBGA
MPC8315ECVRADDA MPU POWERQUICC II PRO 620-PBGA
AMM43DRMT-S288 CONN EDGECARD 86POS .156 EXTEND
MPC8314EVRAGDA MPU POWERQUICC II PRO 620-PBGA
AMC60DRTN-S734 CONN EDGECARD 120PS DIP .100 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8313ZQAFFC 功能描述:微處理器 - MPU 8313 REV2.2 PB NO ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8313ZQAGDC 功能描述:微處理器 - MPU 8313 REV2.2 PB NO ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8313ZQGDD 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8313ZQGDDA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8313ZQGDDB 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*