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參數(shù)資料
型號(hào)： MPC8313ECVRAFFB
廠(chǎng)商： Freescale Semiconductor
文件頁(yè)數(shù)： 84/99頁(yè)
文件大?。?/td> 0K
描述： IC MPU POWERQUICC II PRO 516PBGA
標(biāo)準(zhǔn)包裝： 40
系列： MPC83xx
處理器類(lèi)型： 32-位 MPC83xx PowerQUICC II Pro
速度： 333MHz
電壓： 0.95 V ~ 1.05 V
安裝類(lèi)型： 表面貼裝
封裝/外殼： 516-BBGA 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝： 516-PBGAPGE（27x27）
包裝： 托盤(pán)
配用： MPC8313E-RDB-ND - BOARD PROCESSOR
MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
85
RJC is device related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RCA. For instance, the user can change the size of the heat
sink, the airflow around the device, the interface material, the mounting arrangement on the printed-circuit
board, or change the thermal dissipation on the printed-circuit board surrounding the device.
To illustrate the thermal performance of the devices with heat sinks, the thermal performance has been
simulated with a few commercially available heat sinks. The heat sink choice is determined by the
application environment (temperature, airflow, adjacent component power dissipation) and the physical
space available. Because there is not a standard application environment, a standard heat sink is not
required.
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in Table 70. More detailed thermal
models can be made available on request.
Table 70. Thermal Resistance for TEPBGAII with Heat Sink in Open Flow
Heat Sink Assuming Thermal Grease
Airflow
Thermal Resistance
(
C/W)
Wakefield 53
53 2.5 mm pin fin
Natural convection
13.0
0.5 m/s
10.6
1 m/s
9.7
2 m/s
9.2
4 m/s
8.9
Aavid 35
31 23 mm pin fin
Natural convection
14.4
0.5 m/s
11.3
1 m/s
10.5
2 m/s
9.9
4 m/s
9.4
Aavid 30
30 9.4 mm pin fin
Natural convection
16.5
0.5 m/s
13.5
1 m/s
12.1
2 m/s
10.9
4 m/s
10.0
Aavid 43
41 16.5 mm pin fin
Natural convection
14.5
0.5 m/s
11.7
1 m/s
10.5
2 m/s
9.7
4 m/s
9.2
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MPC8313ECVRAFFC 功能描述:微處理器 - MPU 8313 REV2.2 W/ENC EXT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8313ECVRAGDB 功能描述:微處理器 - MPU PBGA W/ ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8313ECVRAGDC 功能描述:微處理器 - MPU 8313 REV2.2 W/ENC EXT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8313ECVRGDD 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8313ECVRGDDA 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
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