- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄4077 > MPC8313CZQADDB (Freescale Semiconductor)MPU POWERQUICC II PRO 516-PBGA PDF資料下載
參數(shù)資料
| 型號： | MPC8313CZQADDB |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 83/99頁 |
| 文件大?。?/td> | 0K |
| 描述： | MPU POWERQUICC II PRO 516-PBGA |
| 標(biāo)準(zhǔn)包裝： | 40 |
| 系列： | MPC83xx |
| 處理器類型： | 32-位 MPC83xx PowerQUICC II Pro |
| 速度： | 267MHz |
| 電壓： | 0.95 V ~ 1.05 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 516-BBGA 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 516-PBGAPGE（27x27） |
| 包裝： | 托盤 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁當(dāng)前第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁
MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
84
Freescale Semiconductor
(edge) of the package is approximately the same as the local air temperature near the device. Specifying
the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
TJ = TB + (RJB PD)
where:
TJ = junction temperature (C)
TB = board temperature at the package perimeter (C)
RJB = junction-to-board thermal resistance (C/W) per JESD51–8
PD = power dissipation in the package (W)
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction
temperature can be made. The application board should be similar to the thermal test condition: the
component is soldered to a board with internal planes.
21.2.3
Experimental Determination of Junction Temperature
To determine the junction temperature of the device in the application after prototypes are available, the
thermal characterization parameter (
JT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (JT PD)
where:
TJ = junction temperature (C)
TT = thermocouple temperature on top of package (C)
JT = thermal characterization parameter (C/W)
PD = power dissipation in the package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
21.2.4
Heat Sinks and Junction-to-Case Thermal Resistance
In some application environments, a heat sink is required to provide the necessary thermal management of
the device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction to case
thermal resistance and a case to ambient thermal resistance:
RJA = RJC + RCA
where:
RJA = junction-to-ambient thermal resistance (C/W)
RJC = junction-to-case thermal resistance (C/W)
RCA = case-to- ambient thermal resistance (C/W)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC8315ECVRADDA | MPU POWERQUICC II PRO 620-PBGA |
| AMM43DRMT-S288 | CONN EDGECARD 86POS .156 EXTEND |
| MPC8314EVRAGDA | MPU POWERQUICC II PRO 620-PBGA |
| AMC60DRTN-S734 | CONN EDGECARD 120PS DIP .100 SLD |
| MPC8323CVRAFDC | IC MPU PWRQUICC II 516-PBGA |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8313CZQADDC | 功能描述:微處理器 - MPU 8313 REV2.2 PB NO EN EXT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8313CZQAFD | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8313CZQAFDA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8313CZQAFDB | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8313CZQAFF | 功能描述:微處理器 - MPU 8313 PB PBGA W/O ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。