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參數(shù)資料
| 型號： | MPC8280ZQPKBX |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA516 |
| 封裝： | 27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-516 |
| 文件頁數(shù)： | 55/80頁 |
| 文件大?。?/td> | 1301K |
| 代理商： | MPC8280ZQPKBX |
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MPC8280 PowerQUICC II Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
59
Pinout
Figure 16 shows the side profile of the PBGA package to indicate the direction of the top surface view.
Figure 16. Side View of the PBGA Package Remove
NOTE: Temperature Reflow for the VR Package
In the VR package, sphere composition is lead-free (refer to Table 2). This requires
higher temperature reflow than what is required for other PowerQUICC II
packages. Users should consult “Freescale PowerQUICC II Pb-Free Packaging
Information” (MPC8250PBFREEPKG) available at www.freescale.com.
Table 23 shows the pinout list of the MPC8275 and MPC8270. Table 22 defines conventions and acronyms used in
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
BR
C16
BG
D2
ABB/IRQ2
C1
TS
D1
A0
D5
A1
E8
A2
C4
A3
B4
A4
A5
D7
A6
D8
A7
C6
A8
B5
A9
B6
A10
C7
Die
Transfer molding compound
1 mm pitch
Wire bonds
attach
DIE
Ball bond
Screen-printed
solder mask
Cu substrate traces
BT resin glass epoxy
Plated substrate via
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