參數(shù)資料
    型號： MPC8272CZQF
    廠商： FREESCALE SEMICONDUCTOR INC
    元件分類： 微控制器/微處理器
    英文描述： 32-BIT, EPROM, 133 MHz, RISC MICROCONTROLLER, PBGA516
    封裝： 27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-516
    文件頁數(shù)： 7/61頁
    文件大?。?/td> 394K
    代理商： MPC8272CZQF
    MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 3
    Freescale Semiconductor
    15
    Thermal Characteristics
    4.2
    Estimation with Junction-to-Case Thermal Resistance
    Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal
    resistance and a case-to-ambient thermal resistance:
    RθJA = RθJC + RθCA
    where:
    RθJA = junction-to-ambient thermal resistance (C/W)
    RθJC = junction-to-case thermal resistance (C/W)
    RθCA = case-to-ambient thermal resistance (C/W)
    RθJC is device related and cannot be influenced by the user. The user adjusts the thermal environment to
    affect the case-to-ambient thermal resistance, RθCA. For instance, the user can change the air flow around
    the device, add a heat sink, change the mounting arrangement on the printed circuit board, or change the
    thermal dissipation on the printed circuit board surrounding the device. This thermal model is most useful
    for ceramic packages with heat sinks where some 90% of the heat flows through the case and the heat sink
    to the ambient environment. For most packages, a better model is required.
    4.3
    Estimation with Junction-to-Board Thermal Resistance
    A simple package thermal model which has demonstrated reasonable accuracy (about 20%) is a
    two-resistor model consisting of a junction-to-board and a junction-to-case thermal resistance. The
    junction-to-case thermal resistance covers the situation where a heat sink is used or where a substantial
    amount of heat is dissipated from the top of the package. The junction-to-board thermal resistance
    describes the thermal performance when most of the heat is conducted to the printed circuit board. It has
    been observed that the thermal performance of most plastic packages, especially PBGA packages, is
    strongly dependent on the board temperature.
    If the board temperature is known, an estimate of the junction temperature in the environment can be made
    using the following equation:
    TJ = TB + (RθJB × PD)
    where:
    RθJB = junction-to-board thermal resistance (C/W)
    TB = board temperature (C)
    PD = power dissipation in package
    If the board temperature is known and the heat loss from the package case to the air can be ignored,
    acceptable predictions of junction temperature can be made. For this method to work, the board and board
    mounting must be similar to the test board used to determine the junction-to-board thermal resistance,
    namely a 2s2p (board with a power and a ground plane) and by attaching the thermal balls to the ground
    plane.
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    相關代理商/技術參數(shù)
    參數(shù)描述
    MPC8272CZQI 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications
    MPC8272CZQM 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications
    MPC8272CZQMIBA 功能描述:微處理器 - MPU PQ27E A W/ TALITOS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
    MPC8272CZQP 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications
    MPC8272CZQPIEA 功能描述:微處理器 - MPU PQ27E A W/ TALITOS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
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