參數(shù)資料
型號(hào): MPC8271VRE
廠商: Motorola, Inc.
英文描述: MPC8272 PowerQUICC II Family Hardware Specifications
中文描述: MPC8272的PowerQUICC II系列硬件規(guī)格
文件頁(yè)數(shù): 17/56頁(yè)
文件大小: 539K
代理商: MPC8271VRE
17
MPC8272 PowerQUICC II Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
AC Electrical Characteristics
Figure 5 shows the SCC/SMC/SPI/I
2
C external clock.
Figure 5. SCC/SMC/SPI/I
2
C External Clock Diagram
Figure 6 shows the SCC/SMC/SPI/I
2
C internal clock.
Figure 6. SCC/SMC/SPI/I
2
C Internal Clock Diagram
Serial CLKin
SCC/SMC/SPI/I2C input signals
(See note)
SCC/SMC/SPI/I2C output signals
(See note)
sp18b
sp19b
sp38b/sp39b
Note
: There are four possible timing conditions for SCC and SPI:
1. Input sampled on the rising edge and output driven on the rising edge (shown).
2. Input sampled on the rising edge and output driven on the falling edge.
3. Input sampled on the falling edge and output driven on the falling edge.
4. Input sampled on the falling edge and output driven on the rising edge.
BRG_OUT
SCC/SMC/SPI/I2C input signals
(See note)
SCC/SMC/SPI/I2C output signals
(See note)
sp18a
sp19a
sp38a/sp39a
Note
: There are four possible timing conditions for SCC and SPI:
1. Input sampled on the rising edge and output driven on the rising edge (shown).
2. Input sampled on the rising edge and output driven on the falling edge.
3. Input sampled on the falling edge and output driven on the falling edge.
4. Input sampled on the falling edge and output driven on the rising edge.
F
Freescale Semiconductor, Inc.
n
.
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相關(guān)代理商/技術(shù)參數(shù)
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MPC8271VRP 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications
MPC8271VRPIEA 功能描述:微處理器 - MPU 300 MHz 570 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324