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參數(shù)資料
| 型號： | MPC8271CZQT |
| 廠商： | Motorola, Inc. |
| 英文描述： | MPC8272 PowerQUICC II Family Hardware Specifications |
| 中文描述： | MPC8272的PowerQUICC II系列硬件規(guī)格 |
| 文件頁數(shù)： | 51/56頁 |
| 文件大?。?/td> | 539K |
| 代理商： | MPC8271CZQT |
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51
MPC8272 PowerQUICC II Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
Package
9
Package
Figure 13 shows the side profile of the PBGA package.
Figure 13. Side View of the PBGA Package Remove
Table 20 provides package parameters. Figure 14 provides the mechanical dimensions and bottom surface
nomenclature of the 516 PBGA package.
NOTE: Temperature Reflow for the VR Package
In the VR package, sphere composition is lead-free (refer to Table 2). This
requires higher temperature reflow than what is required for other
PowerQUICC II packages. Users should consult “Motorola PowerQUICC II
Pb-Free Packaging Information” (MPC8250PBFREEPKG) available at
www.motorola.com/semiconductors.
Table 20. Package Parameters
Code
Type
Outline
(mm)
Interconnects
Pitch
(mm)
Nominal Unmounted
Height (mm)
VR, ZQ
PBGA
27 x 27
516
1
2.25
Die
attach
Transfer molding compound
1 mm pitch
Wire bonds
Ball bond
DIE
Screen-printed
solder mask
Cu substrate traces
Resin glass epoxy
Plated substrate via
F
Freescale Semiconductor, Inc.
n
.
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