- 您現(xiàn)在的位置：買賣IC網 > PDF目錄369926 > MPC8271CVRT (Motorola, Inc.) MPC8272 PowerQUICC II Family Hardware Specifications PDF資料下載
參數(shù)資料
| 型號： | MPC8271CVRT |
| 廠商： | Motorola, Inc. |
| 英文描述： | MPC8272 PowerQUICC II Family Hardware Specifications |
| 中文描述： | MPC8272的PowerQUICC II系列硬件規(guī)格 |
| 文件頁數(shù)： | 11/56頁 |
| 文件大?。?/td> | 539K |
| 代理商： | MPC8271CVRT |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁當前第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁
MOTOROLA
MPC8272 PowerQUICC II Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
For More Information On This Product,
Go to: www.freescale.com
11
Thermal Characteristics
4
Thermal Characteristics
Table 6 describes thermal characteristics. Refer to Table 2 for information on a given device’s package.
Discussions of each characteristic are provided in sections 4.1 through 4.7. For the these discussions, P
D
=
(V
DD
×
I
DD
) + PI/O, where PI/O is the power dissipation of the I/O drivers.
Table 6. Thermal Characteristics
4.1
Estimation with Junction-to-Ambient Thermal
Resistance
An estimation of the chip junction temperature, T
J
, in °C can be obtained from the equation:
T
J
= T
A
+ (R
θ
JA
×
P
D
)
where:
T
A
= ambient temperature (oC)
R
θ
JA
= package junction-to-ambient thermal resistance (oC/W)
P
D
= power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value which provides a quick and easy
estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated
that errors of a factor of two (in the quantity T
J
–
T
A
) are possible.
Characteristic
Symbol
Value
Unit
Air Flow
Junction-to-ambient—
single-layer board
1
1
Assumes no thermal vias
2
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
3
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
4
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
R
θ
JA
27
°
C/W
Natural convection
21
1 m/s
Junction-to-ambient—
four-layer board
R
θ
JA
19
°
C/W
Natural convection
16
1 m/s
Junction-to-board
2
R
θ
JB
11
°
C/W
—
Junction-to-case
3
R
θ
JC
8
°
C/W
—
Junction-to-package top
4
R
θ
JT
2
°
C/W
—
F
Freescale Semiconductor, Inc.
n
.
相關PDF資料 |
PDF描述 |
|---|---|
| MPC8271CZQ | MPC8272 PowerQUICC II Family Hardware Specifications |
| MPC8271CZQB | MPC8272 PowerQUICC II Family Hardware Specifications |
| MPC8271CZQE | MPC8272 PowerQUICC II Family Hardware Specifications |
| MPC8271CZQI | MPC8272 PowerQUICC II Family Hardware Specifications |
| MPC8271CZQM | MPC8272 PowerQUICC II Family Hardware Specifications |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8271CVRTIEA | 功能描述:微處理器 - MPU 400 MHz 760 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8271CZQ | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:MPC8272 PowerQUICC II Family Hardware Specifications |
| MPC8271CZQB | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8271CZQE | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8271CZQI | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
發(fā)布緊急采購，3分鐘左右您將得到回復。