參數(shù)資料
型號: MPC826XACZU
廠商: Motorola, Inc.
英文描述: Hardware Specifications
中文描述: 硬件規(guī)格
文件頁數(shù): 43/48頁
文件大小: 662K
代理商: MPC826XACZU
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
43
Package Description
1.5
Package Description
The following sections provide the package parameters and mechanical dimensions for the MPC826xA.
1.5.1
Package Parameters
Package parameters are provided in Table 21. The package type is a 37.5 x 37.5 mm, 480-lead TBGA.
Table 21. Package Parameters
Parameter
Value
Package Outline
37.5 x 37.5 mm
Interconnects
480 (29 x 29 ball array)
Pitch
1.27 mm
Nominal unmounted package height 1.55 mm
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