
MPC8260A PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 1.1
Freescale Semiconductor
47
Package Description
5.2
Mechanical Dimensions
Figure 15 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA
package.
Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature
Dim
Millimeters
Min
Max
A
1.45
1.65
A1
0.60
0.70
A2
0.85
0.95
A3
0.25
—
b
0.65
0.85
D
37.50 BSC
D1
35.56 REF
e
1.27 BSC
E
37.50 BSC
E1
35 56 REF
Notes:
1. Dimensions and Tolerancing per
ASME Y14.5M-1994.
2. Dimensions in millimeters.
3. Dimension b is measured at the