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參數(shù)資料
| 型號(hào)： | MPC8266AVRPIBX |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA516 |
| 封裝： | PLASTIC, BGA-516 |
| 文件頁數(shù)： | 4/52頁 |
| 文件大?。?/td> | 884K |
| 代理商： | MPC8266AVRPIBX |
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MPC8260A PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 1.1
12
Freescale Semiconductor
Electrical and Thermal Characteristics
2.2
Thermal Characteristics
Table 4 describes thermal characteristics.
2.3
Power Considerations
The average chip-junction temperature, TJ, in °C can be obtained from the following:
TJ = TA + (PD x θJA)
(1)
where
TA
θ
JA = package thermal resistance, junction to ambient, °C/W
PD = PINT + PI/O
PINT = IDD x VDD Watts (chip internal power)
PI/O = power dissipation on input and output pins (determined by user)
For most applications PI/O < 0.3 x PINT. If PI/O is neglected, an approximate relationship between PD and
TJ is the following:
Notes:
1. The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent
excessive DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as
outputs.
2. The leakage current is measured for nominal VDD, VCCSYN, and VDD.
3. MPC8265 and MPC8266 only.
Table 4. Thermal Characteristics for 480 TBGA Package
Characteristics
Symbol
Value
Unit
Air Flow
Junction to ambient
θJA
13(1)
Notes:
1. Assumes a single layer board with no thermal vias
°C/W
NC(2)
2. Natural convection
101
1 m/s
11(3)
3. Assumes a four layer board
NC
83
1 m/s
Junction to board(4)
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature
is measured on the top surface of the board near the package.
θJB
4
°C/W
—
Junction to case(5)
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
θJC
1.1
°C/W
—
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