參數(shù)資料
型號(hào)： MPC8265AZUPJDC
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 41/50頁(yè)
文件大小： 0K
描述： IC MPU POWERQUICC II 480-TBGA
標(biāo)準(zhǔn)包裝： 21
系列： MPC82xx
處理器類型： 32-位 MPC82xx PowerQUICC II
速度： 300MHz
電壓： 2V
安裝類型： 表面貼裝
封裝/外殼： 480-LBGA
供應(yīng)商設(shè)備封裝： 408-TBGA（37.5x37.5）
包裝： 托盤
MPC8260A PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2.0
46
Freescale Semiconductor
Package Description
5
Package Description
The following sections provide the package parameters and mechanical dimensions for the MPC826xA.
5.1
Package Parameters
Package parameters are provided in Table 22. The package type is a 37.5
× 37.5 mm, 480-lead TBGA.
3 On PCI devices (MPC8265 and MPC8266) this pin should be used as CLKIN2. On non-PCI devices (MPC8260A and
MPC8264) this is a spare pin that must be pulled down or left floating.
4 Must be pulled down or left floating.
5 On PCI devices (MPC8265 and MPC8266) this pin should be asserted if the PCI function is desired or pulled up or
left floating if PCI is not desired. On non-PCI devices (MPC8260A and MPC8264) this is a spare pin that must be pulled
up or left floating.
6 For information on how to use this pin, refer to MPC8260 PowerQUICC II Thermal Resistor Guide available at
www.freescale.com.
Table 22. Package Parameters
Parameter
Value
Package Outline
37.5
× 37.5 mm
Interconnects
480 (29
× 29 ball array)
Pitch
1.27 mm
Nominal unmounted package height 1.55 mm
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