參數(shù)資料
型號(hào): MPC8264ACVVMIBB
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 1/50頁(yè)
文件大?。?/td> 0K
描述: IC MPU POWERQUICC II 480-TBGA
標(biāo)準(zhǔn)包裝: 21
系列: MPC82xx
處理器類型: 32-位 MPC82xx PowerQUICC II
速度: 266MHz
電壓: 2V
安裝類型: 表面貼裝
封裝/外殼: 480-LBGA
供應(yīng)商設(shè)備封裝: 408-TBGA(37.5x37.5)
包裝: 托盤(pán)
Freescale Semiconductor, Inc., 2005–2009. All rights reserved.
Freescale Semiconductor
Technical Data
This document contains detailed information on power
considerations, DC/AC electrical characteristics, and AC
timing specifications for .25
μm (HiP4) devices in the
PowerQUICC II MPC8260 communications processor
family. These devices include the MPC8260, the MPC8255,
the MPC8264, the MPC8265, and the MPC8266.
Throughout this document, these devices are collectively
referred to as the MPC826xA.
Document Number: MPC8260AEC
Rev. 2.0, 06/2009
Contents
MPC8260A
PowerQUICC II Integrated
Communications Processor
Hardware Specifications
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8264ACZU 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:MPC826xA (HiP4) Family Hardware Specifications
MPC8264ACZUMIBB 功能描述:微處理器 - MPU POWERQUICC II HIP4 REV B RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8264AVR 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:MPC826xA (HiP4) Family Hardware Specifications
MPC8264AVVMHBB 功能描述:微處理器 - MPU PQ II HIP4 REV B RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8264AVVPIBB 功能描述:微處理器 - MPU PQ II HIP4 REV B RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324