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參數(shù)資料
| 型號： | MPC8260AZUPJDB |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA480 |
| 封裝： | 37.50 X 37.50 MM, TBGA-480 |
| 文件頁數(shù)： | 28/40頁 |
| 文件大?。?/td> | 527K |
| 代理商： | MPC8260AZUPJDB |
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34
MPC8260 (HiP3) Hardware Specications
MOTOROLA
Ordering Information
1.5.2
Mechanical Dimensions
Figure 15 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA package.
Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature
1.6
Ordering Information
Figure 16 provides an example of the Motorola part numbering nomenclature for the MPC8260. In addition
to the processor frequency, the part numbering scheme also consists of a part modier that indicates any
enhancement(s) in the part from the original production design. Each part number also contains a revision
code that refers to the die mask revision number and is specied in the part numbering scheme for
identication purposes only. For more information, contact your local Motorola sales ofce.
Dim
Millimeters
Min
Max
A
1.45
1.65
A1
0.60
0.70
A2
0.85
0.95
A3
0.25
—
b
0.65
0.85
D
37.50 BSC
D1
35.56 REF
e
1.27 BSC
E
37.50 BSC
E1
35.56 REF
Notes:
1. Dimensions and Tolerancing per
ASME Y14.5M-1994.
2. Dimensions in millimeters.
3. Dimension b is measured at the
maximum solder ball diameter,
parallel to primary data A.
4. Primary data A and the seating
plane are dened by the spherical
crowns of the solder balls.
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