參數(shù)資料
型號(hào)： MPC8260ACVVMIBB
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 4/50頁(yè)
文件大?。?/td> 0K
描述： IC MPU POWERQUICC II 480-TBGA
標(biāo)準(zhǔn)包裝： 21
系列： MPC82xx
處理器類型： 32-位 MPC82xx PowerQUICC II
速度： 266MHz
電壓： 2V
安裝類型： 表面貼裝
封裝/外殼： 480-LBGA
供應(yīng)商設(shè)備封裝： 408-TBGA（37.5x37.5）
包裝： 托盤
配用： MPC8260ADS-TCOM-ND - BOARD DEV ADS POWERQUICC II
MPC8260A PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2.0
12
Freescale Semiconductor
Electrical and Thermal Characteristics
2.2
Thermal Characteristics
Table 4 describes thermal characteristics.
2.3
Power Considerations
The average chip-junction temperature, TJ, in °C can be obtained from the following:
TJ = TA + (PD x θJA)
(1)
where
TA = ambient temperature °C
θ
JA = package thermal resistance, junction to ambient, °C/W
PD = PINT + PI/O
PINT = IDD x VDD Watts (chip internal power)
PI/O = power dissipation on input and output pins (determined by user)
For most applications PI/O < 0.3 x PINT. If PI/O is neglected, an approximate relationship between PD and
TJ is the following:
PD = K/(TJ + 273° C)
(2)
Solving equations (1) and (2) for K gives:
K = PD x (TA + 273° C) + θJA x PD
2
(3)
2 The leakage current is measured for nominal VDD, VCCSYN, and VDD.
3 MPC8265 and MPC8266 only.
Table 4. Thermal Characteristics for 480 TBGA Package
Characteristics
Symbol
Value
Unit
Air Flow
Junction to ambient
θJA
131
1 Assumes a single layer board with no thermal vias
°C/W
NC2
2 Natural convection
1 m/s
113
3 Assumes a four layer board
NC
83
1 m/s
Junction to board4
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
θJB
4
°C/W
—
Junction to case5
5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
θJC
1.1
°C/W
—
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