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參數(shù)資料
| 型號： | MPC8250AZUPIBB |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA480 |
| 封裝： | 37.50 X 37.50 MM, TBGA-480 |
| 文件頁數(shù)： | 2/73頁 |
| 文件大?。?/td> | 885K |
| 代理商： | MPC8250AZUPIBB |
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10
MPC8250 Hardware Specications
MOTOROLA
Electrical and Thermal Characteristics
1.2.2
Thermal Characteristics
Table 4 describes thermal characteristics.
1.2.3
Power Considerations
The average chip-junction temperature, TJ, in °C can be obtained from the following:
TJ = TA + (PD x θJA)
(1)
where
TA = ambient temperature °C
θ
JA = package thermal resistance, junction to ambient, °C/W
PD = PINT + PI/O
PINT = IDD x VDD Watts (chip internal power)
PI/O = power dissipation on input and output pins (determined by user)
For most applications PI/O < 0.3 x PINT. If PI/O is neglected, an approximate relationship between PD and TJ
is the following:
PD = K/(TJ + 273° C)
(2)
Solving equations (1) and (2) for K gives:
K = PD x (TA + 273° C) + θJA x PD
2
(3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring
PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving
equations (1) and (2) iteratively for any value of TA.
Table 4. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Air Flow
480 TBGA
(ZU package)
516 PBGA
(VR package)
Junction to ambient—
single-layer board1
1 Assumes no thermal vias
θJA
13
24
°C/W
Natural convection
10
18
1 m/s
Junction to ambient—
four-layer board
11
16
Natural convection
8
13
1 m/s
Junction to board2
2 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
θJB
48
°C/W
—
Junction to case3
3 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
θJC
1.1
6
°C/W
—
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| MPC8250AZUPIBC | 功能描述:微處理器 - MPU POWER QUICC II HIP4C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8250VR | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Hardware Specifications |
| MPC8255 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:MPC826xA (HiP4) Family Hardware Specifications |
| MPC8255ACVVMHBB | 功能描述:微處理器 - MPU PQ II HIP4 REV B RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8255ACVVMIBB | 功能描述:微處理器 - MPU PQ II HIP4 REV B RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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