- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄45354 > MPC8250ACZQIHBB (MOTOROLA INC) 32-BIT, 200 MHz, RISC PROCESSOR, PBGA516 PDF資料下載
參數(shù)資料
| 型號(hào)： | MPC8250ACZQIHBB |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA516 |
| 封裝： | 27 X 27 MM, 1.25 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-516 |
| 文件頁(yè)數(shù)： | 3/73頁(yè) |
| 文件大?。?/td> | 885K |
| 代理商： | MPC8250ACZQIHBB |
第1頁(yè)第2頁(yè)當(dāng)前第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)
MOTOROLA
MPC8250 Hardware Specications
11
Electrical and Thermal Characteristics
1.2.3.1
Layout Practices
Each VCC pin should be provided with a low-impedance path to the board’s power supply. Each ground pin
should likewise be provided with a low-impedance path to ground. The power supply pins drive distinct
groups of logic on chip. The VCC power supply should be bypassed to ground using at least four 0.1 F
by-pass capacitors located as close as possible to the four sides of the package. The capacitor leads and
associated printed circuit traces connecting to chip VCC and ground should be kept to less than half an inch
per capacitor lead. A four-layer board is recommended, employing two inner layers as VCC and GND planes.
All output pins on the MPC8250 have fast rise and fall times. Printed circuit (PC) trace interconnection
length should be minimized in order to minimize overdamped conditions and reections caused by these
fast output switching times. This recommendation particularly applies to the address and data buses.
Maximum PC trace lengths of six inches are recommended. Capacitance calculations should consider all
device loads as well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and
bypassing becomes especially critical in systems with higher capacitive loads because these loads create
higher transient currents in the VCC and GND circuits. Pull up all unused inputs or signals that will be inputs
during reset. Special care should be taken to minimize the noise levels on the PLL supply pins.
Table 5 provides preliminary, estimated power dissipation for various congurations. Note that suitable
thermal management is required for conditions above PD = 3W (when the ambient temperature is 70 C or
greater) to ensure the junction temperature does not exceed the maximum specied value. Also note that the
I/O power should be included when determining whether to use a heat sink.
1.2.4
AC Electrical Characteristics
The following sections include illustrations and tables of clock diagrams, signals, and CPM outputs and
inputs for the 66 MHz MPC8250 device. Note that AC timings are based on a 50-pf load. Typical output
buffer impedances are shown in Table 6.
Table 5. Estimated Power Dissipation for Various Congurations1
1 Test temperature = room temperature (25 C)
Bus
(MHz)
CPM
Multiplier
Core CPU
Multiplier
CPM
(MHz)
CPU
(MHz)
PINT(W)
2
2 P
INT = IDD x VDD Watts
Vddl 1.8 Volts
Vddl 2.0 Volts
Nominal
Maximum
Nominal
Maximum
66.66
2
3
133
200
1.2
2
1.8
2.3
66.66
2.5
3
166
200
1.3
2.1
1.9
2.3
66.66
3
4
200
266
—
2.3
2.9
66.66
3
4.5
200
300
—
2.4
3.1
83.33
2
3
166
250
—
2.2
2.8
83.33
2
3
166
250
—
2.2
2.8
83.33
2.5
3.5
208
291
—
2.4
3.1
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC8250ACZQIHBB | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA516 |
| MPC8250AVRIHBB | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA516 |
| MPC8250AZUPIBB | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA480 |
| MPC8250AZQIHBB | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA516 |
| MPC8250ACZUMHBB | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA480 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8250ACZQIHBC | 功能描述:微處理器 - MPU PWR QUICC II HIP4BZQ RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8250ACZUMHBC | 功能描述:微處理器 - MPU POWER QUICC II HIP4C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8250ACZUMHBC | 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 266MHZ 480-TBGA |
| MPC8250AVRIHBC | 功能描述:微處理器 - MPU PWR QUICC II HIP4CVR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8250AVVMHBC | 功能描述:微處理器 - MPU PQ 2 HIP4 REV-C NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。