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| 型號(hào)： | MPC8247ZQTIEX |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 400 MHz, RISC PROCESSOR, PBGA516 |
| 封裝： | 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, PLASTIC, MS-034AAL-1, BGA-516 |
| 文件頁數(shù)： | 3/60頁 |
| 文件大?。?/td> | 918K |
| 代理商： | MPC8247ZQTIEX |
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MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 1.5
Freescale Semiconductor
11
Thermal Characteristics
4
Thermal Characteristics
Table 6 describes thermal characteristics. Refer to Table 2 for information on a given device’s package.
Discussions of each characteristic are provided in sections 4.1 through 4.7. For the these discussions,
PD =(VDD × IDD) + PI/O, where PI/O is the power dissipation of the I/O drivers.
4.1
Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in C can be obtained from the equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature (C)
RθJA = package junction-to-ambient thermal resistance (C/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value which provides a quick and easy
estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated
that errors of a factor of two (in the quantity TJ – TA) are possible.
4
The leakage current is measured for nominal VDDH,VCCSYN, and VDD.
5
MPC8272 and MPC8271 only.
Table 6. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Air Flow
Junction-to-ambient—
single-layer board 1
1
Assumes no thermal vias
RθJA
27
°C/W
Natural convection
21
1 m/s
Junction-to-ambient—
four-layer board
RθJA
19
°C/W
Natural convection
16
1 m/s
Junction-to-board 2
2
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
RθJB
11
°C/W
—
Junction-to-case 3
3
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
RθJC
8
°C/W
—
Junction-to-package top 4
4
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
RθJT
2
°C/W
—
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| MPC8247ZQTMFA | 功能描述:微處理器 - MPU PQ27E A W/O TALITOS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8248 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:MPC8272 PowerQUICC II Family Hardware Specifications |
| MPC8248CVR | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:MPC8272 PowerQUICC II Family Hardware Specifications |
| MPC8248CVRB | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8248CVRE | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
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