- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄369925 > MPC8247ZQ (Motorola, Inc.) MPC8272 PowerQUICC II Family Hardware Specifications PDF資料下載
參數(shù)資料
| 型號(hào)： | MPC8247ZQ |
| 廠商： | Motorola, Inc. |
| 英文描述： | MPC8272 PowerQUICC II Family Hardware Specifications |
| 中文描述： | MPC8272的PowerQUICC II系列硬件規(guī)格 |
| 文件頁數(shù)： | 51/56頁 |
| 文件大?。?/td> | 539K |
| 代理商： | MPC8247ZQ |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁當(dāng)前第51頁第52頁第53頁第54頁第55頁第56頁
51
MPC8272 PowerQUICC II Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
Package
9
Package
Figure 13 shows the side profile of the PBGA package.
Figure 13. Side View of the PBGA Package Remove
Table 20 provides package parameters. Figure 14 provides the mechanical dimensions and bottom surface
nomenclature of the 516 PBGA package.
NOTE: Temperature Reflow for the VR Package
In the VR package, sphere composition is lead-free (refer to Table 2). This
requires higher temperature reflow than what is required for other
PowerQUICC II packages. Users should consult “Motorola PowerQUICC II
Pb-Free Packaging Information” (MPC8250PBFREEPKG) available at
www.motorola.com/semiconductors.
Table 20. Package Parameters
Code
Type
Outline
(mm)
Interconnects
Pitch
(mm)
Nominal Unmounted
Height (mm)
VR, ZQ
PBGA
27 x 27
516
1
2.25
Die
attach
Transfer molding compound
1 mm pitch
Wire bonds
Ball bond
DIE
Screen-printed
solder mask
Cu substrate traces
Resin glass epoxy
Plated substrate via
F
Freescale Semiconductor, Inc.
n
.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC8248ZQE | MPC8272 PowerQUICC II Family Hardware Specifications |
| MPC8248ZQI | MPC8272 PowerQUICC II Family Hardware Specifications |
| MPC8248ZQM | MPC8272 PowerQUICC II Family Hardware Specifications |
| MPC8248ZQP | MPC8272 PowerQUICC II Family Hardware Specifications |
| MPC8248ZQT | MPC8272 PowerQUICC II Family Hardware Specifications |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8247ZQB | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8247ZQE | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8247ZQI | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8247ZQM | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8247ZQMIBA | 功能描述:微處理器 - MPU PQ27E A W/O TALITOS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。