參數(shù)資料
型號: MPC8247CZQTIEA
廠商: Freescale Semiconductor
文件頁數(shù): 6/61頁
文件大小: 0K
描述: IC MPU POWERQUICC II 516-PBGA
標準包裝: 40
系列: MPC82xx
處理器類型: 32-位 MPC82xx PowerQUICC II
速度: 400MHz
電壓: 1.5V
安裝類型: 表面貼裝
封裝/外殼: 516-BBGA
供應(yīng)商設(shè)備封裝: 516-FPBGA(27x27)
包裝: 托盤
MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 3
14
Freescale Semiconductor
Thermal Characteristics
4
Thermal Characteristics
This table describes thermal characteristics. See Table 2 for information on a given SoC’s package.
Discussions of each characteristic are provided in Section 4.1, “Estimation with Junction-to-Ambient
Thermal Resistance,” through Section 4.7, “References.” For the these discussions, PD =(VDD × IDD) +
PI/O, where PI/O is the power dissipation of the I/O drivers.
4.1
Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in C can be obtained from the following equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature (C)
RθJA = package junction-to-ambient thermal resistance (C/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated
that errors of a factor of two (in the quantity TJ – TA) are possible.
4 MPC8280, MPC8275VR, MPC8275ZQ only.
Table 7. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Air Flow
Junction-to-ambient—
single-layer board1
1 Assumes no thermal vias
RθJA
27
°C/W
Natural convection
21
1 m/s
Junction-to-ambient—
four-layer board
RθJA
19
°C/W
Natural convection
16
1 m/s
Junction-to-board2
2 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
RθJB
11
°C/W
Junction-to-case3
3 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
RθJC
8
°C/W
Junction-to-package top4
4 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
RθJT
2
°C/W
相關(guān)PDF資料
PDF描述
IDT7005L15J8 IC SRAM 64KBIT 15NS 68PLCC
MPC8313CVRAGDB MPU POWERQUICC II PRO 516-PBGA
FSM43DSEI-S13 CONN EDGECARD 86POS .156 EXTEND
FI-X20M-NPB CONN PLUG FFC 1MM 20POS
HMC65DRAN-S734 CONN EDGECARD 130PS .100 R/A PCB
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8247VR 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:MPC8272 PowerQUICC II Family Hardware Specifications
MPC8247VRB 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications
MPC8247VRE 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications
MPC8247VRI 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications
MPC8247VRM 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications